Express-SL2
Specifications
7
2.16. Functional Diagram
Mobile 6
th
Gen
Intel® Xeon®
Intel® Core™
Intel® Celeron®
Processor
(“Skylake H”)
Thermal
Sensor
TPM
2.0
Mobile Intel®
QM170/HM170/CM236
Chipset
GPIO
AB
GP I2C
CD
SPI 0
BIOS
LPC bus
PCIe x16 Gen3
1 x16, 2 x8,
or 1 x8 + 2 x4
SPI
DM
I
HD Audio
3x SATA 6Gb/s
(port 0/1/2)
8x USB 2.0
SPI 1
BIOS
DDC I2C
SODIMM 2
1866/2133 MHz
DDR4
SPI_CS#
DDI 1
DP/HDMI/DVI
DDI 2
DP/HDMI/DVI
single/dual
18/24 bit LVDS
6x PCIe x1 Gen3
(port 0-5)
New
SEMA
BMC
eDP - LVDS
GbE
i219 LM/V
PCIe x1
SMBus
SMBus
SODIMM 1
1866/2133 MHz
DDR4
eDP x2
eDP x4
VGA
DP-to-VGA
Switch
PEG or
DDI
PEG
or
DDI 1
DDI 2
PCIe-to-PCI
PCI
PCIe
SATA-to-PATA
PATA
SATA
4GPI, 4GPO
1x SATA 6Gb/s (port 3)
Figure 1: Express-SL2 Functional Block Diagram
Содержание Express-SL2
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