Introduction
13
EGX-MXM-T1000
1.7
Thermal Policy
The GPU core clock throttles at temperatures (T
J
) past the thresh-
olds shown with the behaviors as listed. Thermal throttling ensures
that the highest temperature on the die does not exceed the sense
temperature for prolonged periods of time.
Table 1-4: Thermal Policy
1.8
Unpacking Checklist
Before unpacking, check the shipping carton for any damage. If
the shipping carton and/or contents are damaged, inform your
dealer immediately. Retain the shipping carton and packing
materials for inspection. Obtain authorization from your dealer
before returning any product to ADLINK. Ensure that the fol-
lowing items are included in the package.
X
EGX-MXM-T1000 embedded graphics module
Parameter
Value
Units
Thermal Resistance (Junction to Case, RJC)
0.039
°C/W
Thermal Resistance (Junction to PCB Board, RJB)
1.71
°C/W
GPU Maximum Operating Temperature1
89
°C
GPU Slowdown Temperature (THERM_ALERT)2
95
°C
GPU Shutdown Temperature (OVERT)3
100
°C
NOTE:
NOTE:
X
Max.GPU operating temperature is the maximum at
which the GPU is guaranteed to operate at target perfor-
mance (base clock) under total board power level
X
THERM_ALERT generates a 50% (÷2) hardware clock
slowdown.
X
OVERT generates a 87.5% (÷8) hardware clock slow-
down
Содержание EGX-MXM-T1000
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