MC97F2664
April 11, 2014 Ver. 1.4
47
7.21 Recommended Circuit and Layout
{
}
M
C
9
7
F
2
6
6
4
XOUT
XIN
I/O
VSS
VDD
High-Current Part
Infrared LED,
FND(7-Segment),
,,,,,
etc
{ }
0.01uF
VCC
0.1uF
This 0.1uF capacitor should be within
1cm from the VDD pin of MCU on the
PCB layout.
{
}
This 0.01uF capacitor is alternatively
for noise immunity.
X-tal
SXOUT
SXIN
32.768kHz
The main and sub crystal should be within 1cm from the pins of MCU on the PCB layout.
+
0.1uF
VDD
VCC
{
}
The MCU power line (VDD and VSS)
should be separated from the high-
current part at a DC power node on
the PCB layout.
DC Power
The load capacitors of the sub clock
- C1, C2: C
L
x 2 ± 15%
- C
L
= (C1 x C2)/(C1 + C2) - Cstray
- C
L
: the specific capacitor value of crystal
- Cstray: the parasitic capacitor of a PCB (1pF
–
1.5pF)
C1
C2
Figure 7.17 Recommended Circuit and Layout
Содержание MC97F2664
Страница 20: ...MC97F2664 20 April 11 2014 Ver 1 4 4 Package Diagram Figure 4 1 64 Pin LQFP 1010 Package...
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Страница 23: ...MC97F2664 April 11 2014 Ver 1 4 23 Figure 4 4 44 Pin MQFP 1010 Package...