4D systems gen4-HMI Series, Техническое описание

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gen4-HMI Display Modules
gen4-uLCD-50D Page 14 of 29 www.4dsystems.com.au
5.5. Application PCB Support
The gen4 5.0” Diablo16 Integrated Display Module is
designed to accommodate a range of applications, and
therefore is suited for those wanting to make a
customised module, without the need for piggy-back
or daughter boards mounted on headers.
On the back of the gen4 module, the display related
circuitry will be found, which is recessed into the
plastic. The level of the plastic on the back of the gen4
module is higher than the tallest component on the
display circuit PCB, meaning an Application PCB can be
mounted on the back of the gen4, without affecting
the display related circuitry.
The image below (4.3” model depicted) shows a mock
Application PCB on the back of the gen4 display (Blue
area). It features a cut-out in the PCB so access to the
micro-SD socket on the gen4’s display board is
possible, however this may or may not be required
depending on the application and if the micro-SD
socket is utilised or requiring access once the
Application PCB is applied.
The 30 way FFC flex cable out of the gen4 into the
application board can either turn up through a slot in
the application board, or can travel down under the
gen4 plastic and emerge at the bottom, and then into
the application board (as depicted above).
The micro-SD socket is a latch type, so it is accessible
from the top, rather than a push/push or push/pull
style which is accessible from the side.
5.6. RF / EMI Shielding Support
As per what is written in section 5.5 (Application PCB
Support), there is an option for extended RF shielding
and EMI protection on this module.
On the back of the gen4’s display PCB, are grounded
plated ‘X pads’, which make contact with the metal
housing of the display.
Where the Application PCB is shown to sit in Section
5.5, can house a small metal shield of the same size.
This shield is used instead of, or underneath an
Application PCB, to aid the on-board electronics in the
prevention from potential RF or EMI signals.
On the top of the display PCB is more GND pads, which
can have a pogo pin or similar device mounted on
them, which can make contact with this metal shield.
The display electronics are then sandwiched between
the display’s metal housing, and the metal shield, all
connected together with a common ground.
NOTE: There are no guarantees these steps will
increase chances or grant access to EMI related
certifications, however the gen4 has the capability to
utilise shielding of the modules electronics, should the
need arise. This may or may not assist the User with
protecting the device against EMI/EMF/RF type noise,
depending on the source, strength and type of noise
present, however should aid in the protection.