EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Pr oduct End-of-Life Disassembly Instr uctions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HP Integrity BL860c i4 Server Blades
HP Integrity BL870c i4 Server Blades
HP Integrity BL890c i4 Server Blades
Purpose:
The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0
Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Server unit is configurable and may contain some of
the following assemblies:
AM377-60001 PCA, BL8x0c i4 System Board
AD399-2134A CPU Socket Airflow baffle
AM377-60002 PCA, BL1
AM377-60003 PCA, BL2
AM377-60010 PCA, BL2EM
AM377-60011 PCA, BL2ES
AM377-60006 PCA, BL4M
AM377-60007 PCA, BL4S
AM377-60033 PCA, Upgrade BL2
AM377-60036 PCA, Upgrade BL4M
AD399-60009 PCA, SAS BackPlane
AM377-60013 PCA, ICH w/TPM
AD399-60013 PCA, ICH-WITHOUT TPM
AT085-2022A HP BL8x0c i4 Itanium 9560 8c Proc
AT085-2021A HP BL8x0c i4 Itanium 9540 8c Proc
AT085-2020A HP BL8x0c i4 Itanium 9550 4c Proc
AT085-2019A HP BL8x0c i4 Itanium 9520 4c Proc
AT085-2026A HP BL8x0c i4 Itanium 9560 8c Proc
AT085-2025A HP BL8x0c i4 Itanium 9540 8c Proc
Up to 137
(when fully
loaded)
