HP ProLiant 100-series Intel-based G6 server
technology
Technology brief, 3
rd
edition
Abstract.............................................................................................................................................. 3
Introduction......................................................................................................................................... 3
Intel Xeon 5500 Series processor technology .......................................................................................... 3
Multi-level caches............................................................................................................................. 4
QuickPath Interconnect controller ....................................................................................................... 4
Hyper Threading.............................................................................................................................. 5
Turbo Boost technology..................................................................................................................... 5
Intel Xeon 3400 Series processor technology .......................................................................................... 6
Memory.............................................................................................................................................. 8
DDR-3............................................................................................................................................. 8
DIMM Choices............................................................................................................................. 8
Memory Mirroring with DDR-3 ..................................................................................................... 10
Memory channel interleaving....................................................................................................... 10
Lockstep memory mode ............................................................................................................... 10
I/O technologies ............................................................................................................................... 11
PCI Express technology................................................................................................................... 11
HP Smart Array and SAS/SATA technology ...................................................................................... 11
SAS-2 standard.......................................................................................................................... 12
New generation HP Smart Array controllers .................................................................................. 12
Battery backed write cache ......................................................................................................... 13
Zero Memory RAID..................................................................................................................... 13
Software RAID ........................................................................................................................... 13
Smart Array Advanced Pack........................................................................................................ 13
Networking technologies ................................................................................................................ 14
Power and thermal technologies .......................................................................................................... 14
Efficient power delivery................................................................................................................... 14
Common Slot power supplies....................................................................................................... 15
Redundant power operation ........................................................................................................ 16
Voltage regulation ...................................................................................................................... 16
Improved thermal sensors and fan control ......................................................................................... 16
Phase shedding ............................................................................................................................. 16
Memory phase shedding............................................................................................................. 16
Dynamic CPU phase shedding ..................................................................................................... 17
Managing processor technologies.................................................................................................... 17
QuickPath Interconnect power...................................................................................................... 17
Disabling processor cores............................................................................................................ 17
C-state package limit setting ........................................................................................................ 17
Managing memory technologies ...................................................................................................... 17
Memory channel interleaving....................................................................................................... 17
Maximum memory data rates....................................................................................................... 17
Managing I/O technologies............................................................................................................ 18
