Abstract
This document provides guidance for end-of-life recyclers on how
to identify and disassemble reportable materials in compliance
with the Waste Electrical and Electronic Equipment (WEEE)
directive. The document does not replace disposal instructions in
EMC contracts, or those included in
EMC
Product and Residuals
Disposal Guidelines
.
May 2019
WEEE DISASSEMBLY
INSTRUCTIONS
for the 12G High Availability Disk Array Enclosure (DAE)
Summary of Contents for 302-002-206
Page 3: ...3 Part Number 302 002 206...
Page 10: ...10 8 2 2 5 Disk Figure 3 2 5 disk 8 3 Fan Module Figure 4 Fan module 1 2...
Page 23: ...23...
Page 24: ...24 Link Controller Card PCB Base board PCB 6i 5a...
Page 25: ...25 PIC PCB Power supply Interface Card Horn PCB FRC PCB Fan Riser Card 6h 6m 6n...
