Hardware Development Guide of Module Product
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Figure 3-2 Antenna Interface Flag Diagram (with Diversity)
Figure 3-3 Radio Frequency Interface Test Base
This product antenna is placed on the side of the system board, it is recommended that antenna
space size is above 7 mm * 10 mm * 100 mm. If this product is embedded in a notebook, place it
on the top of the LCD screen.
3.3
Thermal Design
The thermal design of this product strictly complies with the specification [PCI Express Mini
Card Electromechanical Specification Revision 1.2, October 26, 2007], and distributes the heat
source evenly, and has excellent heat dissipating design. But as the maximum power
consumption of the overall system in the LTE standard is very high, if it is impossible to ensure
ZM8620 ambient temperature is lower than 60 °C, the rise of the overall system temperature will
lead to the decline of ZM8620 performance, and even it cannot operate normally. In order to
ensure to bring the product working performance into full play, the following proposals are
provided for the main board design:
(a) Design heat dissipating chip for ZM8620. Design it at a place as closely to the outer
casing as possible and design heat dissipating holes in the corresponding position.
(b) Conduct shiny copper processing near the main board on ZM8620 BOTTOM surface
to reach sound heat dissipating path.
Summary of Contents for ZM8620
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