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LPM2100 mg NB Module Hardware User Guide

Shanghai Yuge Information Technology Co., Ltd.

- 36 -

Chapter 5. Interface electrical characteristics

5.1 Chapter overview

temperature range

Module IO level

power supply

Electrostatic property

Reliability index.

5.2 Range of working temperature

Table 5-1 LPM2100 mg series module temperature range

Parameter

Minimum

Maximum

Normal operating temperature

-20

°

C

75

°

C

Extreme working temperature

-40

°

C

85

°

C

Storage temperature

-45

°

C

90

°

C

5.3 Module IO level

The LPM2100 mg series module port IO levels are as follows:
Which corresponds to 1.8V SIM application, SIM_VDD is 1.8V; corresponding to 3V

SIM application, SIM_VDD is 3V.

Table 5-2 Electrical Characteristics of the LPM2100 mg Series Module

Parameter Parameter Description

Minimum

Maximum

VIH

High level input voltage

0.7* VDD_EXT VDD_EXT

VIL

Low level input voltage

-

0.3*VDD_EXT

VOH

High level output voltage

0.7*VDD_EXT

VDD_EXT

VOL

Low level output voltage

0

5.4 Power supply

LPM2100 mg series module input power supply requirements are as follows

Table 5-3 Operating voltage of the LPM2100 mg series module

Parameter

Description

Minimum

Typical

Maximum

Summary of Contents for LPM2100 mg

Page 1: ...PM2100 mg NB Module Hardware User Guide Number of pages 44 Hardware design version V1 0 Document version V1 5 Date 2019 11 7 LPM2100 mg NB Module Hardware User Guide V1 5 Shanghai Yuge Information Tec...

Page 2: ...19 5 17 John zhang Modify some information about hardware V1 1 interface changes V1 2 2019 6 22 John zhang 1 Unified limit operating temperature 2 Modify information related to IO voltage domain V1 3...

Page 3: ...distribution map 11 3 2 2 Module pin description 12 3 3 Power interface 15 3 3 1 VBAT interface 15 3 3 2 VDD_EXT Voltage output 16 3 4 Switching machine reset mode 16 3 4 1 Boot 16 3 4 2 Shut down 17...

Page 4: ...ncy 34 4 6 Conducted transmit power and receive sensitivity 34 4 7 RF power consumption characteristics 35 Chapter 5 Interface electrical characteristics 36 5 1 Chapter overview 36 5 2 Range of workin...

Page 5: ...3 16 SIM circuit design 24 Figure 3 17 SIM card hot swap detection circuit 25 Figure 3 18 SPI read timing diagram 26 Figure 3 19 SPI write timing diagram 26 Figure 3 20 I2C interface reference circuit...

Page 6: ...PI Signal Definition 26 Table 3 11 I2C pin definition 27 Table 3 12 Network indicator pin definition 27 Table 3 13 Network indication status 27 Table 3 14 General GPIO Pin Definitions 28 Table 4 1 RF...

Page 7: ...NB module of the wireless solution product It is intended to describe the hardware components and functional characteristics of the module solution application interface definition and usage instruct...

Page 8: ...d NB IoT series module that complies with 3GPP Release 13 With a total of 44 pins and an ultra small size of 15 8mm 17 7mm 2 2mm the modules meet almost all M2M requirements This series of modules is...

Page 9: ...sor 192MHz MIPS processor with 16KB I Cache and 16KB D Cache Operating Voltage Low voltage 2 45V 4 21V Typical voltage 3 6V Standard voltage 3 1V 4 2V Typical voltage 3 7V Power saving PSM mode power...

Page 10: ...n antenna 50 ohm interface Bluetooth antenna 50 ohm interface reserved Firmware upgrade Serial port upgrade Temperature range Normal operating temperature 20 C to 75 C Extreme operating temperature 40...

Page 11: ...odule RF circuit and cannot interact with the network Sleep The module turns off most of the functions and will be synchronized with the network Idle Power on and successfully register the network in...

Page 12: ...otal of 44 pins and include the following partial unit interface functions The functions of each unit interface will be described in detail in later chapters Power interface USIM interface UART interf...

Page 13: ...s module defines that the NC pin is floating and must not be used The module WAKEUP PSM_EINT pin voltage domain is 1 1V 3 2 2 Module pin description The module interface pin definition is described be...

Page 14: ...ive low SIM interface 2 SIM_DECT DI SIM card hot plug detection Internal level has been pulled up 10 SIM_GND SIM card ground GND 11 SIM_DATA IO SIM card bus data Internal 10K pull up resistor 12 SIM_R...

Page 15: ...ll up 33 SDA IO I2C bus data input and output Internal 10K resistor pull up SPI interface 3 SPI_MISO DI Host input slave output IO voltage domain 4 SPI_MOSI DO Host output slave input IO voltage domai...

Page 16: ...e The LPM2100 mg series module power connector consists of two parts VBAT is the working power of the module VDD_EXT is the internal LDO output IO voltage domain current load up to 50mA for external u...

Page 17: ...in will output the IO voltage domain and the current load can be up to 50mA The external master can read the voltage of VDD_EXT to judge whether the module is powered on VDD_EXT can also be used as an...

Page 18: ...ugh a mechanical push button switch A TVS tube is placed near the button for ESD protection The reference circuit diagram is as follows Figure 3 6 Mechanical button boot 3 4 2 Shut down The LPM2100 mg...

Page 19: ...RESET reset pin The application detects that the module is abnormal When the software does not respond the module can be reset Pull the pin low for 100 450ms to reset the module The RESET pin is sensi...

Page 20: ...Data Communication Equipment device The main serial port can realize AT interactive instructions and peripheral data interaction Debug the serial port to upgrade the firmware view log information and...

Page 21: ...ltage domain Table 3 6 Serial port logic levels Parameter Minimum Maximum Unit VIL 0 0 3 VDD_EXT V VIH 0 7 VDD_EXT VDD_EXT V VOL 0 0 3 VDD_EXT V VOH 0 7 VDD_EXT VDD_EXT V 3 5 1Serial application circu...

Page 22: ...ption mode 3 6 1 PSM The main purpose of the PSM function is to reduce module power consumption and extend battery life The module consumes a maximum of 5uA in PSM mode Suitable for services that have...

Page 23: ...to be reachable at any time with a small delay The module will detect whether there is a downlink service arrival which is suitable for services with high latency requirements Module equipment genera...

Page 24: ...IM_DECT DI SIM card hot plug detection Internal level has been pulled up 10 SIM_GND SIM card ground GND 11 SIM_DATA IO SIM card bus data Internal 10K pull up resistor 12 SIM_RST DO SIM card reset outp...

Page 25: ...ly pulled up to VDD_EXT with a 100K resistor and no external pull up is required SIM_DECT is the SIM card inserted or not inserted detection pin the default is high level the SIM card status can be de...

Page 26: ...normally open SIM card holder the detection level can be set by the AT command If AT HOSCFG 1 1 is set the state of the SIM card is high when it is in position When AT HOSCFG 1 0 is set the state of t...

Page 27: ...ries module provides a set of SPI interfaces with an interface voltage of IO output level Table 3 10 SPI Signal Definition Pin Pin name IO Functional description Remarks 3 SPI_MISO DI Host input slave...

Page 28: ...as shown below Figure 3 20 I2C interface reference circuit The I2C_SCL and I2C_SDA pins are internally pulled up so the external pull up resistor can be ignored during use 3 11 Network indication int...

Page 29: ...pose GPIO interface The LPM2100 mg series modules offer two GPIOs Some of these GPIOs can be reused for multiple functions Consult the module provider for specific usage Table 3 14 General GPIO Pin De...

Page 30: ...gure 3 22 WAKEUP wake up module reference circuit 3 13 2 WAKEUP_OUT interface The LPM2100 mg series modules support the WAKEUP_OUT function When the module is in the sleep state if a wake up event is...

Page 31: ...t design the trace between the module and the antenna must be guaranteed to 50 ohms The antenna is a sensitive device that is susceptible to the external environment For example module size antenna po...

Page 32: ...tenna matching circuit diagram LPM2100 mg series module two antennas are extracted by pad method The antenna impedance trace needs to be away from the digital signal line power supply and other interf...

Page 33: ...the material the trace width W the ground clearance S and the height of the reference ground plane H Please use the impedance simulation tool to calculate the impedance value of the RF trace The contr...

Page 34: ...nnector must use a 50 ohm characteristic impedance coaxial connector Hirose s UF L R SMT connector is recommended Figure 4 6 RF connector size chart The RF connector plug for this connector is HRS s U...

Page 35: ...49 MHz 869 MHz 894 MHz B8 880 MHz 915 MHz 925 MHz 960 MHz B20 832 MHz 862 MHz 791 MHz 821 MHz B28 703 MHz 748 MHz 758 MHz 803 MHz 4 6 Conducted transmit power and receive sensitivity Table 4 4 Conduct...

Page 36: ...echnology Co Ltd 35 4 7 RF power consumption characteristics Table 4 6 Power consumption Types Power MAX Call Current mA Power Avg Current B1 22 1 Max power 151 B3 22 3 Max power 140 B5 23 Max power 1...

Page 37: ...Module IO level The LPM2100 mg series module port IO levels are as follows Which corresponds to 1 8V SIM application SIM_VDD is 1 8V corresponding to 3V SIM application SIM_VDD is 3V Table 5 2 Electr...

Page 38: ...S The protective device PCB layout should be as close as possible to the V shaped line to avoid the T shaped line The ground plane around the module guarantees integrity and should not be split ESD co...

Page 39: ...mperature 20 Working mode normal work Test duration 30 Cycles 1 h 1h cycle JESD22 A 105 B Visual inspection normal Function check normal RF indicator check normal Drop test Height 0 8 m 6 sides each t...

Page 40: ...cal properties 6 1 Chapter overview Exterior Module mechanical size 6 2 Exterior The LPM2100 mg series module is a PCBA with a single sided layout The appearance of the module is as follows Figure 6 1...

Page 41: ...LPM2100 mg NB Module Hardware User Guide Shanghai Yuge Information Technology Co Ltd 40 Figure 6 3 Bottom view of the LPM2100 mg series module unit MM...

Page 42: ...lete the patch within 72 hours and the module can directly perform reflow soldering or other high temperature process If the module is in other conditions it needs to be baked before the patch If the...

Page 43: ...7 1 Reflow soldering temperature graph Table 7 1 Reflow process parameter table Warm zone Time key parameter Preheating zone 40 165 Heating rate 1 s 3 s Temperature zone 160 210 t1 t2 70s 120s Recircu...

Page 44: ...ate CTS Clear to Send DTR Data Terminal Ready DL Down Link DTE Data Terminal Equipment EMC Electromagnetic Compatibility ESD Electrostatic Discharge LED Light Emitting Diode NC Not Connected PCB Print...

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