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© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
R7001_EA2_EB2 • 5/19/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Miniature Signal Relays – EA2/EB2
Soldering Process
EA2 – Through-hole Mounting
Automatic Soldering
Preheating: 110–120°C/110 seconds (maximum)
Solder temperature: 260°C maximum
Solder time: 5 seconds maximum
Note: KEMET recommends cooling down a printed circuit board to less than 110°C within 40 seconds after soldering.
Manual Soldering
Solder temperature: 350°C maximum
Solder time: 3 seconds maximum
EB2 – Surface Mounting
IRS Method
200
180
190 (Maximum 300)
45 (Maximum 70)
70 (Maximum 120)
220
200
180
Temperature
(˚
C)
220
Maximum 240
˚
C
Time (seconds)
Note: Temperature profile shows printed circuit board surface temperature on the relay terminal portion.
Please consult KEMET if you wish to use a temperature profile other than above.