Xsens MTi 600 Series, Hardware Integration Manual, Page: 3 / 17

www.xsens.com iii Document MT1601P.A
© Xsens Technologies B.V. Hardware Integration Manual MTi 600-series
Table of Contents
1 GENERAL INFORMATION
................................................................................................................... 1
2 INTERFACES
...................................................................................................................................... 2
2.1 P
IN
C
ONFIGURATION
.......................................................................................................................... 2
2.2 C
OMMUNICATION TO HOST
.................................................................................................................. 3
2.2.1 CAN
..................................................................................................................................... 3
2.2.2 RS232
.................................................................................................................................. 3
2.2.3 UART
................................................................................................................................... 4
2.3 GNSS
RECEIVER INTERFACE
.................................................................................................................. 4
2.4 SYNC
............................................................................................................................................ 5
3 ELECTRICAL SPECIFICATIONS
.............................................................................................................. 6
3.1 S
UPPLY VOLTAGE
............................................................................................................................... 6
3.2 P
OWER CONSUMPTION
....................................................................................................................... 6
3.3 I/O
PINS
......................................................................................................................................... 6
4 DESIGN
............................................................................................................................................. 8
4.1 S
ENSOR REFERENCE FRAMES
................................................................................................................. 8
4.2 O
RIGIN OF ACCELEROMETER
................................................................................................................. 8
4.3 P
HYSICAL CONNECTIONS
...................................................................................................................... 9
4.3.1 Footprint for PCB layout
........................................................................................................ 9
4.3.2 Footprint for standalone mounting
...................................................................................... 10
4.4 M
ECHANICAL STRESS
........................................................................................................................ 11
4.4.1 Vibrations
.......................................................................................................................... 11
4.5 M
AGNETOMETER
............................................................................................................................ 11
4.5.1 Ferromagnetic materials
..................................................................................................... 11
4.5.2 High currents
..................................................................................................................... 11
5 PACKAGING INFORMATION
............................................................................................................. 13