Xilinx Virtex-4 QV FPGA, Manual

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176 www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging
UG496 (v1.1) June 8, 2012
Chapter 5: Thermal Specifications
R
For more information on CGA technology and PCB recommendations refer to the Ceramic
Column Grid Assembly and Rework User Guide by IBM ( http://www.ibm.com ).
Thermal Resistance and Package Mass
Virtex-4 QV FPGAs are offered exclusively in CF packages for high thermal cycle
reliability. The Virtex-4 QV FPGA ceramic packages thermal resistance and package mass
data is listed in
Table 5-1 . Additionally the junction-to-case and junction-to-board data
(based on standard JEDEC four-layer measurements) is provided.
X-Ref Target - Figure 5-1
Figure 5-1: CF Package Construction
UG496_C05_01_04010 8
S ilicon C a r b ide He a t- S pre a der
Therm a l Adhe s ive
Flip-Chip
S older B u mp s
Underfill Epoxy
S older Col u mn
M u lti-L a yer Cer a mic Subs tr a te
Table 5-1:
Package Device
Package Body
Size
θ
JC
(°C/Watt)
θ
JB
(°C/Watt)
θ
JA
(°C/Watt)
Mass
(grams)
CF1140 SX55 35mm
×
35mm 0.12 2.57 9.2 24.6
CF1144 FX60 35mm
×
35mm 0.12 2.93 9.2 30.0
CF1509
FX140 40mm
× 40
mm 0.10 2.21 8.1 34.0
LX200 40mm
× 40
mm 0.10 2.27 8.1 33.8