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IQ30 3.5" Embedded SBC User Manual
1.4 SBC Specifications
Model Name
IQ30-100
System
Specification
CPU
Qualcomm Snapdragon™ 660 octa-core, 2.2 GHz
Memory
3 GB LPDDR4 (Optional 4 GB base on MOQ 1K)
Storage
32
GB MLC
Operating System Android 9.0
Display
Specification
Interface
1 x LVDS (MIPI to LVDS)
RF
WLAN
Wi-Fi a/b/g/n/ac
BT
BT 5.0
Audio
Codec
PM660L
Audio Interface
Speaker, Line Out, MIC
I/O Connectors
Rear I/O
2 x USB 2.0 Type A
1 x Terminal Block(Optional for 12V DC Jack)
1 x Micro SD Card Slot
1 x Micro SIM Card Slot
1 x USB Type-C
1 x LAN(USB to LAN AX8817A)
1 x RS232/422/485(Full COM)
Internal I/O
2 x Backlight wafer(5V/3.3V)
1 x LVDS (DF13/FPC)
2 x DMIC (4 Pin Wafer/Per)
2 x USB 2.0 Touch (FFC Connector)
1 x GPIO for 5 key OSD (6 Pin Wafer)
1 x GPIO For Membrane (2x5 Wafer)
2 x Speaker (L/R, 2 Pin Wafer)
1 x 14 Pin DIDO (6 DI, 6 DO, GND, 5V)
1 x 4 Pin Wafer CANBus With Isolation
(CANH, CANL, 5V)(Optional)
1 x 10 Pin COM Port (Full COM RS232, 5V)
3 x USB 2.0 (2x4 Wafer/per)
1 x RTC Battery
1 x Debug Port (6 Pin Wafer)
1 x 5V output (2 Pin Wafer)
1 x 3.3V output (2 Pin Wafer)
1 x UART (TX, RX, 3.3V, GND)
1 x M.2 (PCIe Signal With USB)
1 x I2C
2 x ANT (Wi-Fi, BT)
Power
Requirements
Power Input
12 - 24V DC input
** DC 12V in only of use panel with DC 12V panel power.
Power
Consumption
3W
Mechanical
Specifications
Dimensions
3.5" Form Factor (146 mm x 102 mm)
Environment
Considerations
Operating
Temperature
-20 deg. C to 60 deg. C
Storage
Temperature
-40 deg. C to 70 deg. C
Operating
Humidity
10% to 95% (non-condensing, RH)
