WIN Enterprises MB-80670, User Manual

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WIN Enterprises, Inc. PL-80670 User Manual 8
Chapter 1. Generation Information
1.1 Introduction
MB-80670 is built with next Generation Intel® Core™ SoC processor, Having one SO-DIMM
DDR3L 1600MHz memory capacity and an integrated GT2/GT3 graphics; the MB-80670 is
capable of providing a 24-bit dual-channel LVDS and two HDMI 1.4a display interface which
supports 4k resolution display. As for I/O ports the MB-80670 provide plenty of connectivity,
such as 2 x Intel® Gigabit Ethernet, 1 x RS-232/433/485 & 3 x RS-232, USB3.0, Audio, SATA
6Gb/s, 1 x LPC pin-header supporting WIN’s TPM module. MB-80670 also comes with a
lockable DC jack or a 4-pin internal power connector for easy power integration.
MB-80670 that could accept wide range DC 8V ~ 32V input, a external DC locking power jack or a 4-pin
internal power connector for easier power integration.
MB-80670 is a small form-factor embedded platform equipped with Intel® high performance
GT2/GT3 Graphics and also rich IO ports, make MB-80670 suitable for a wide range of applications in
digital signage, POS, kiosks, and factory automation. Fanless design are allowed for high temperature
and dusty environments.
WIN offers reliable and solid products which are produced under Management System Standards:
ISO9001-2000 Certificate. The certificate keeps us focused on our quality objectives of management
and environmental protection. Its willingness to customize standard products for meet unique customer
needs makes WIN different. All ODM projects are welcome. Years of experience enables WIN to fulfill
the customer’s vision, by delivering products to exact specifications. WIN R&D team is proud of its
strong engineering background. R&D professionals account for 25% of the WIN workforce. We focus
on developing new products for both emerging and established markets.
For information about OEM/ODM projects contact WIN at:
Email: consultants@win-ent.com Tel: +1 (978) 688-2000