GR4x to GR64 Migration Guide
2.2.11
Mechanical Form Factor
The GR64 modem circuitry is significantly different to the predecessor device, being
far more highly integrated. The result is that the wireless modem is fabricated on one
side of the board. This single-sided arrangement results in a greatly reduced
thickness and the ability to retain one side of the board unpopulated, except for the
RF connector.
The GR64 mechanical outline remains the same as its predecessor devices. The
system connector placement, RF connector positioning, and mounting hole locations
are identical. The reduced thickness of the PCB (6-layer compared with the 10-layer
predecessor) means that the RF connector centre-line is approximately 0.2mm lower.
It is estimated that this will have no impact on existing applications, even those with
integrated mechanical housing.
Mechanically, therefore, the GR64 is a true drop-in replacement for the GM/GR4x
products. Comparative assemblies are shown in a subsequent section of this
document.
2.3
General Observations
The fundamental difference in hardware and platform architecture between the
GM/GR4x and the GR64 means that there are bound to be some incompatibilities.
These have been minimized through deliberate and thoughtful replication of the
legacy interfaces. Whilst every measure has been taken to create a functionally
comparable product in GR64, there will be the inevitable fine tuning adjustment of
applications to achieve a drop-in replacement. It has been the aim of Wavecom to
limit any changes to minor ones which are easily and quickly achievable, such as
component value changes.
Migration Guide
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable
GR4x to GR64
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