VisIC V22N65A-HBEVB User Manual Download Page 39

VisIC V22N65A GaN Half Bridge Evaluation Board 
User Manual USG-022650-004

 

 
 

All the above is subject to T’s & C’s agreed by the parties – VER 3.4 

Preliminary Data Sheet:  VisIC, Ltd. reserves the right to make design improvement changes at any time.   

www.visic-tech.com

 

 

 

 

 

 

 

 

User Guide USG-022650-001 

 

Page | 38

Liquid Cooling: 

 

Figure 2 - Assembled Liquid cooling application for V22N65A EVB – tubing not shown in image for better 

visibility. 

The Liquid cooling setup facilitates heat dissipation for operation at very high-power applications. 

The Liquid cooling unit is comprised of 3 main components, as shown in figure 1 -the main head unit 
is  mounted  directly  on  the  PCB  and  is  comprised  of  a  copper  heat  plate  and  liquid  pump.  Heat  is 
dissipated from the device package by the cold liquid flowing through the plate. 

The main head unit is connected to an air-cooled radiator which is responsible for cooling the liquid, 
which is returning from the main unit. The chilled liquid then returns from the radiator, and back to 
the main unit. 

To emphasize the system’s capabilities, this liquid cooling setup was tested on a boost convertor, 200V 
30A input 100kHz (6kW). Under this condition, Thermal IR imagery measured ~55°C on the device. 

The  V22N65A  EVB  is  provided  with  a  pre-installed  liquid  cooling  setup  (Air  cooling  application  is 
included inside the EVB Kit). 

Liquid Cooling Bill of materials(BOM): 

Number 

Property 

Number of 

units 

Remarks 

Liquid cooling head unit -closed loop  

 
 

CAPTAIN 120EX – Gamer 

Storm

Radiator 120X120 

Fan 12V DC 

Knurled Hand Tighten M3 nuts 

Knurled hand Tighten screws 

Radiator  

Fan 12V 

V22 EVB 

liquid 

Inlet 

liquid 

outlet 

Summary of Contents for V22N65A-HBEVB

Page 1: ...time www visic tech com User Guide USG 022650 001 Page 0 Revision Description of Change Date 01 Initial release 12 2017 02 1 General Formatting and wording 2 Addition of chapter 2 1 Switching energy measurement 01 2018 03 1 General changes 2 Update of board schematic 3 Update of manufacturing info 09 2018 04 1 General Formatting and wording 2 Update of board schematic 3 Update of board layout info...

Page 2: ...ve is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 1 User Guide V22N65A HBEVB Half Bridge Evaluation Board for V22N65A GaN Transistor ...

Page 3: ... 1 Basic setup 12 4 2 Board connections 13 4 3 General operation sequence 14 5 Test Procedure Examples 15 5 1 Measurement of switching energy 15 5 1 1 Basics of double pulse method 15 5 1 2 Board operation for measurement of the switching energy 15 5 1 3 Typical measurement results 17 5 2 Typical results of buck converter operation 18 5 3 Study of boost converter efficiency liquid cooling 19 6 App...

Page 4: ...arties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 3 Definitions and abbreviations Term Description ALL Switch ALL Switch V22N65A is an advanced low loss Normally Off GaN power switch NA Component is not assembled ...

Page 5: ...at anytime the circuits are energized All interface circuits power supplies evaluation modules instruments meters scopes and other related apparatus used in a development environment exceeding 50 VRMS 75 VDC must be electrically located within a protected Emergency Power Off EPO protected power strip Use a stable and non conductive work surface Use adequately insulated clamps and wires to attach m...

Page 6: ...vers logic and control circuits and heat sinks The V22N65A HBEVB can be used to demonstrate the performance of the V22N65A GaN devices in power applications where it can be configured into applicable half bridge topologies for example in a Buck or Boost topology The V22N65A HBEVB and the User Guide serve as a reference for system design aspects of gate driver circuits half bridge PCB layout and the...

Page 7: ...ower 8 kW 200 400 BUCK configuration Inductor 200uH Input output capacitors 49uF Efficiency 99 0 Case temperature 70 C Air cooling Output power 6 kW 200 400 BUCK configuration Inductor 200u Input output capacitors 49uF Efficiency 99 0 Case temperature 78 C Input output voltage 50 400 V Aux power supply Aux power supply voltage 11 12 13 V Aux current 450 mA Air cooling 100 Control Logic input s vol...

Page 8: ...oupling synchronization and setting switching dead times It transfers PWM signal from the input pin to one of the output pins while the second output pin is driven by an inverted PWM with programmed dead time For this purpose the isolated driver has an on board programmable dead time generator Programming of the dead time is performed by using of a resistor with a specific value between the dedica...

Page 9: ...oard is optimized to reduce parasitic stray inductance of high current loops subjected to high For the same purpose it is equipped with a set of decoupling capacitors The set includes a number of ceramic capacitors located close to switching components and dedicated to bypass high frequency harmonies of the switched currents To obtain low frequency filtering the board is equipped with two bulk 7 5...

Page 10: ...sed to provide power to the cooler system 3 3 Test points The half bridge test points see Fig 2 a HV DC TP30 MID PIONT TP31 HV DC TP32 are connected with the drain of the upper GaN Switch the mid point of the half bridge and the source of the lower GaN Switch respectively These test points provide a way to observe the voltage waveforms on the switches measure the Rise and Fall times It is recommen...

Page 11: ...point reference Details HV DC TP30 Drain of high side switch HV DC TP31 Source of low side switch MID Point TP32 Half bridge mid point G HS TP33 High Side Gate GND HS PP36 Reference 12V HS TP34 PSU High Side Driver G LS TP37 Low Side Gate GND LS TP40 Reference 12V LS TP38 PSU Low Side Driver GND TP42 Primary ground GND TP43 Primary ground Table 1 Test points primary ground test points short ground...

Page 12: ...1 3 4 Dead time management Management of the dead time is performed by switching of a resistor with specific values between a dedicated pin of the driver to ground Detailed information dead time vs resistance can be found in the data sheet of the Si8239x ISO Driver The board is equipped with four resistors tuned for 20 50 100 150nSec and jumper Fig 2b for switching between values See Table 2 Jumpe...

Page 13: ... a thermography camera See an example of the equipment list in Appendix E List of equipment Fig 4 Basic experimental setup power connections Please pay attention on the following common notes related to any type of experiment with the evaluation board 1 Observing of Gate and Switch voltage waveforms please pay attention that the gates of the GaN Switches should be floating during all experiments I...

Page 14: ...uid cooling is required Take care not to overheat the devices over 75C case temperature The switching devices are not thermally protected and the EVB HB is not overcurrent protected 6 Choosing inductor The inductance should be chosen according to the system design requirements of operating current frequency and permitted ripple Take care not to drive the inductor s to magnetic saturation and avoid...

Page 15: ...d power measurement connections before applying any power or control signals Set target dead times 2 Make sure of the connections polarity The 12VAUX polarity is indicated on the corresponding connector 3 Perform setup for all the devices proper voltage and current limit of main and auxiliary power supply set the load function generator TTL Level 0 5V 4 Turn On the 12V AUX Check illumination of tw...

Page 16: ...ductor is released through the high side GaN Switch see Fig 7 The second turn on of the low side switch causes the specified inductor current to flow through the low side GaN Switch while the voltage on the GaN Switch decreases from its specified level So the above method of current loading of the switch provides a test of the dynamic switching characteristics under real hard switching conditions ...

Page 17: ...coil between the Coil and HV terminals 4 Connect the DC power supply to the terminals HV and HV 5 Please make sure that the designated current path connections on both PCB sides are not shorted 6 The current shunt should be mounted in the designated location on PCB adjacent to the low side GaN Switch source 3 7 High voltage differential probe Bumblebee PMK are connected to HV DC and MID POINT test...

Page 18: ...Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 17 5 1 3 Typical measurement results Fig 9 V22N65A Half Bridge Switching Energy 400V DC Bus 0 00 20 00 40 00 60 00 80 00 100 00 120 00 140 00 160 00 180 00 0 00 10 00 20 00 30 00 40 00 50 00 60 00 Energy uJ Current A ...

Page 19: ...ults of buck converter operation Test conditions Inductor 240uH Sendust E Core Switching Freq 100 kHz Duty Cycle 50 Input voltage 400V Dead time 100ns Output Power 5kW Air cooling Essential results Input 400V 12 941A 5 048kW Output 196 69V 25 36A 4 988kW Efficiency 98 8 Rise time fall time of low side voltage correspondingly 5nSec 6nSec Case Temperature High side switch 57 C a b Fig 10 5kW BUCK a ...

Page 20: ...isIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 19 5 3 Study of boost converter efficiency liquid cooling Tested with Inductor 240uH Sendust E Core Switching Freq 100 50 kHz Duty Cycle 50 Dead time 100ns Input output Voltage 200V 400V Fig 11 Boost Converter Efficiency and Case Temp graphs ...

Page 21: ...ubject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 20 6 Appendix A Schematic V EVB HBV22 SCH 0322 Fig 12 Schematic V EVB HBV22 SCH 0322 upper level ...

Page 22: ...0 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 21 Fig 13 Schematic V EVB HBV22 SCH 0322 Control ...

Page 23: ... 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 22 Fig 14 Schematic V EVB HBV22 SCH 0322 High Side ...

Page 24: ...0 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 23 Fig 15 Schematic V EVB HBV22 SCH 0322 Low Side ...

Page 25: ...e is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 24 7 Appendix B Assembly Drawing V EVB HBV22 ASD 0322 Fig 16 Component side assembly ...

Page 26: ... USG 022650 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 25 Fig 17 Print side assembly ...

Page 27: ...s VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 26 8 Appendix C Layout Drawings V EVB S HBV22 PCB 0322 4 Fig 18 Silk screen on component side component side silk screen mistake R101 and R100 should be replaced See Fig 18 ...

Page 28: ...G 022650 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 27 Fig 19 Silk screen on print side ...

Page 29: ...anual USG 022650 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 28 Fig 20 Top layer ...

Page 30: ...ual USG 022650 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 29 Fig 21 Inner layer 1 ...

Page 31: ...ual USG 022650 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 30 Fig 22 Inner layer 2 ...

Page 32: ...ual USG 022650 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 31 Fig 23 Inner layer 3 ...

Page 33: ...ual USG 022650 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 32 Fig 24 Inner layer 4 ...

Page 34: ...ual USG 022650 004 All the above is subject to T s C s agreed by the parties VER 3 4 Preliminary Data Sheet VisIC Ltd reserves the right to make design improvement changes at any time www visic tech com User Guide USG 022650 001 Page 33 Fig 25 Bottom layer ...

Page 35: ...50V X7R Yageo CC0805KRX7R9BB104 10 4 C178 C186 C197 C199 10n 50V Kemet C0805C103K5RACTU 11 3 C180 C188 C195 47uF 25V X5R TDK C3216X5R1E476M160AC 12 1 NA C201 100p 50V AVX Corporation 08055A101JAT2A 13 4 C202 C203 C204 C205 100pF 50V NPO AVX Corporation 08055A101JAT2A 14 2 NA D3 D22 D12V0H1U2WS 12V 25A Diodes Incorporated D12V0H1U2WS 7 15 1 NA D29 SCS210AJ ROHM SCS210AJTLL 16 1 D33 SCS210AJ ROHM SC...

Page 36: ...49R9L 42 1 R109 174R 1 1 4W KOA RK73H2ATTD1740F 43 2 R110 R111 1k 1 Yageo RC0805FR 071KL 44 2 R112 R113 49R9 1 1 8W Yageo RC0805FR 0749R9L 45 1 R114 0R 5 1 8W Bourns RC0805JR 070RL 46 1 R115 8k87 1 Yageo RC0805FR 078K87L 47 1 R117 24k 1 Yageo RC0805FR 0724KL 48 1 R119 75k 1 Yageo RC0805FR 0775KL 49 1 R122 412R 1 Yageo RC0805FR 07412RL 50 2 R123 R124 2k 1 Yageo RC0805FR 072KL 51 3 R125 R126 R128 56...

Page 37: ...ge 36 10 Appendix E List of equipment Item Equipment S N Notes 1 Oscilloscope HDO6104 2 Power supply TSA1000 15 380 MAGNA POWER 3 Electronic load ARx7 5 500 30 MAGNA POWER 500V 30A 7 5kW 4 Power Analyzer WT1802E YOKOGAWA 5 Power supply DHR3653D 10 2 x 0 36V 2 5A 5V 5A 6 Waveform Generator 33500B Keysight 7 Current probe N2383B Keysight 30A 100MHz 8 Differential probe NA BumbleBee PMK 400MHz 1kV CA...

Page 38: ...e supplied with one or two alternative Cooling Applications This Document will provide a brief overview and detailed mounting instructions for both applications Thermal interface Material TIM The use of TIM is crucial for eliminating microscopic air gaps between device and heat sink The V22N65A package is fully Isolated up to 2 5KV and so there is no need for an Isolating TIM VisIC recommends the ...

Page 39: ...s dissipated from the device package by the cold liquid flowing through the plate The main head unit is connected to an air cooled radiator which is responsible for cooling the liquid which is returning from the main unit The chilled liquid then returns from the radiator and back to the main unit To emphasize the system s capabilities this liquid cooling setup was tested on a boost convertor 200V ...

Page 40: ... tech com User Guide USG 022650 001 Page 39 6 Plastic Hex legs white 45 8 7 Plastic Hex Legs white 10mm 8 8 Plastic nuts white 16 9 Plastic Spacer white 4 10 Metal M3 screws 20mm 4 Liquid Cooling Installation instructions Mounting on board 1 Apply approx 0 1 mm of thermal interface material on the V22N65A devices V22 EVB PCB Liquid cooling main unit Radiator and Fan Water Tubing Power Cables for f...

Page 41: ...ds 4 Place the plastic spacers on top of the plastic nuts 5 Place the metal brackets of the Liquid cooling unit on top of the spacers 6 Screw in the Knurled M3 nuts to the M3 screws on top of metal brackets 7 Tighten the screws until the metal bracket is fully in contact with the spacers and the nuts Avoid pre loading the screws over tightening since this may cause PCB bending 8 Screw in the Knurl...

Page 42: ...ch com User Guide USG 022650 001 Page 41 Mounting Board to Radiator 1 Insert the plastic hex legs male side into the PCB s 100X100mm pitched mechanical mounting holes 2 Screw in the plastic nuts unto the hex legs on top of the PCB 3 Tighten the screws to full contact avoid pre loading the screws over tightening since this may cause PCB bending Figure 12 Liquid Cooling Setup Plastic Hex nuts Plasti...

Page 43: ...o cool 2 power devices in this configuration Although less efficient in dissipating heat this setup is significantly less bulky and easier to work with when easy access to the board and its components is required Air Cooling Bill of materials BOM Number Property Number of units Remarks 1 Heat sink Aluminum 60X60 1 DCC60U V 2 Fan 12V DC 1 3 Springs 4 4 Washer M3 4 5 Nuts M3 4 6 Metal Screws M3 60mm...

Page 44: ...e www visic tech com User Guide USG 022650 001 Page 43 5 Attach the heatsink to the devices VIA inserting the screws into the 50X50 mm pitched mechanical mounting holes 6 Tighten the M3 metal nuts unto the screw until the PCB is in full contact with the nuts 7 Pre load the screws to 0 1 N M of torque Figure 14 Air Cooling Assembly 60mm Metal M3 screws Springs Fan 12V DC Metal M3 nuts 60X60 Heat si...

Page 45: ...equipment used in the operation of nuclear facilities life support machines cardiac defibrillators or similar emergency medical equipment aircraft navigation or communication or control systems air traffic control systems weapons systems authorized or warranted for use in lifesaving life sustaining military or space applications nor in products or systems where failure or malfunction may result in...

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