TSSP570..H
www.vishay.com
Vishay Semiconductors
Datasheet Values Refer to PCN-OPT-1224-2022
Rev. 1.6, 30-Aug-2022
5
Document Number: 82798
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PACKAGE DIMENSIONS
in millimeters
1 ± 0.2
0.
15
4.3 ± 0.2
4.3 ± 0.2
(2.9)
0.
55
(0.95)
0.
55
(1.8)
Pinning from Topview
GND
GND
Out
Vs
(Vs)
(GND)
(GND)
(GND)
0.75 ± 0.05
4 x 0.75 = 3
0.35 ± 0.05
(8 x)
1.5
3
(0.3)
(0.3)
(0.3)
(0.7)
(1.7)
(3.25)
Proposed pad layout from
component side
(dim. for reference only)
(4.3)
(4.3)
(0.35)
(0.8)
(2.75)
4 x 0.75 = 3
(3 x
)
technical drawings
according to DIN
specifications
All dimensions in mm
Not indicated tolerances ± 0.1
Drawing-No.: 6.550-5316.01-4
Issue: 2; 12.02.14
(3 x)
(0.45)
(1.2)
1 2 3 4 5
8 7
6
Marking area
(0.4)
Pin 1 identification
0.475
Allowed offset
outer edge of shield
to solder pads of
molded device
± 0.1 mm
(2.85)
optically effective area
(1)
(1)
(1
)
(1
)
(2)
Pins connected internally.
It is not necessary to connect
externally.
(2)
(2) (2) (2)
