For more information on this and other VIA products,
please visit
www.viatech.com
Step 2
Install five 8mm hex spacers onto the carrier board. The hex spacer must
be placed on top of the board. From the bottom of the board, tighten
the hex spacers by using the M2.5x4mm screws (x5).
VIA Technologies, Inc.
1F, 531, Zhong-zheng Road, Xindian District,
New Taipei City 231, Taiwan
Tel: 886-2-2218-5452
Fax: 886-2-2218-5453
Web:
www.viatech.com
-A4_L
1
2
PVDD
A4_L
3
4
PVDD
GND
5
6
GND
-A5_L
7
8
GND
A5_L
9
10
-A0_L
GND
11
12
A0_L
-A6_L
13
14
GND
A6_L
15
16
-A1_L
GND
17
18
A1_L
-CLK2_L
19
20
GND
CLK2_L
21
22
-A2_L
GND
23
24
A2_L
-A7_L
25
26
GND
A7_L
27
28
-CLK1_L
NC
29
30
CLK1_L
NC
31
32
GND
DDC_PWR
33
34
-A3_L
NC
35
36
A3_L
NC
37
38
SPCLK
NC
39
40
SPD
LVDS
15
1
FANIO
2
FANPWM
3
GND
SYSFAN
16
5V_DIO1
1
2
12V_DIO1
COM_GPO0
3
4
COM_GPI0
COM_GPO1
5
6
COM_GPI1
COM_GPO2
7
8
COM_GPI2
COM_GPO3
9
10 COM_GPI3
GND
11
12 GND
DIO1
17
1 I2C_CLK
2 I2C_DATA
3 GND
I2C_BUS
19
1
SMB_CLK
2
SMB_DATA
3
GND
SMBUS
20
FP_5V
1
2
FP_5V
FP_5V
3
4
-SATA_LED
-PLED
5
6
-PW_BTN
FP_5V
7
8
GND
NC
9
10
RST_SW
NC
11
12
GND
SPEAK
13
14
FP_5V
KEY
15
16
NC
F_PANEL
18
1
+5V
2
SPDIFO
3
GND
SPDIF
21
CD_IN
1
1
CD_IN_L
2
CD_IN_GND
3
CD_IN_GND
4
CD_IN_R
MIC2_FR_L
1
2
AGND
MIC2_FR_R
3
4
FNT_DET
HP_OUT_R
5
6
MIC2_JD
FNT_IO_SENSE
7
8
KEY
HP_OUT_L
9
10 LINE2_JD
+12V 11
12 +12V
AGND 13
14 AGND
F_AUDIO
2
COM_DCD2
1
2
COM_RXD2
COM_TXD2
3
4
COM_DTR2
GND
5
6
COM_DSR2
COM_RTS2
7
8
COM_CTS2
COM_RI2
9
10 KEY
COM2
3
-LP_STB
1
2
-LP_AFD
LP_D0
3
4
-LP_ERR
LP_D1
5
6
-LP_INIT
LP_D2
7
8
-LP_SLIN
LP_D3
9
10
GND
LP_D4
11
12
GND
LP_D5
13
14
GND
LP_D6
15
16
GND
LP_D7
17
18
GND
-LP_ACK
19
20
GND
LP_BUSY
21
22
GND
LP_SLCT
25
26
KEY
LP_PE
23
24
GND
LPT
4
LPC_AD1
1
2
LPC_33M_CLK
-LPC_RESET
3
4
GND
LPC_AD0
5
6
NC
LPC_AD2
7
8
-LPC_FRAME
LPC_SERIRQ
9
10 LPC_AD3
-LPC_DRQ1
11
12 NC
+5V
13
14 +3.3V
+5V
15
16 +3.3V
GND
17
18 GND
GND
19
20 KEY
LPC
5
DIO2
6
5V_DIO2
1
2
12V_DIO2
GPO34
3
4
GPI50
GPO35
5
6
GPI51
GPO36
7
8
GPI52
GPO37
9
10 GPI53
GND 11
12 GND
1
FANIO
2
FANPWM
3
GND
CPUFAN
7
SER0_TX_CON
1
2
SER0_RX_CON
NC
3
4
NC
GND
5
6
NC
SER1_TX_CON
7
8
SER1_RX_CON
NC
9
10 KEY
SER_PORT
11
VUSB
1
2
VUSB
USBD_T0-
3
4
USBD_T1-
5
6
GND
7
8
GND
KEY
9
10 GND
USB2_0/1
9
1
IVDD_IN
2
IVDD_IN
3
BAKLITE_EN
4
BLT_CK
5
BAKLITE_EN
6
BLT_CTRL
7
GND
8
GND
Inverter
14
3VSUS
1
2
-LAN_ACT
3VSUS
3
4
NC
GND
5
6
W_LAN_LED
3VSUS
7
8
GND
KEY
9
10 GND
FLAN_LED
22
SPI_VCC
1
2 GND
-SPI_SS0
3
4 SPI_CLK
SPI_DI
5
6 SPI_DO
KEY
7
8 RESET
SPI
10
2
Installing SODIMM memory
on COMe-9X90 module
Step 1
Align the notch on the memory module with the protruding wedge on the
SODIMM slot. Insert the memory module into the slot at 30 degrees angle.
Installing COMe-9X90 module
to COMEDB4 carrier board
Step 6
Connect the CPU fan connector cable.
Step 1
Locate the carrier board mounting points (x5) and the connectors (x2).
Step 5
Install the heatsink on COMe-9X90 module. Secure it with four M2.5x15mm
screws (with 3mm plastic washer).
1
Step 3
Align the pin connectors and mounting points of the COMe-9X90 module
into the connectors and hex spacers on the carrier board respectively. Then
press down the COMe-9X90 module until the pin connectors have been
fully inserted into the connectors.
Onboard Pin headers and Connectors
Step 2
Push down until the memory module snaps into place. The memory slot has
two locking mechanisms that will click once the memory module has been
fully inserted.
Pins
Description
1-2
Enabled COM2 pin header
to s5V
2-3
Normal (default)
3-4
Enabled COM2 pin header
to s12V
24
JP_COM2_VSEL
23
Pins
Description
1-2
Enabled COM1 pin header
to s5V
2-3
Normal (default)
3-4
Enabled COM1 pin header
to s12V
JP_COM1_VSEL
Pins
Description
1-2
Keep CMOS setting (default)
2-3
Clear CMOS setting
36
CLEAR_CMOS
Pins
Description
1-2
Enabled USB 2.0 port 3 pin header. (default)
3-4
Enabled USB 2.0 port 3 pin header. (default)
28
JP_USBP3_SEL
Pins
Description
1-2
Use +5V for the Inverter power.
2-3
Use +12V for the Inverter power. (default)
30
IVDD
Pins Description
1-2
Use +5V for the
LCD panel power.
2-3
Use +3.3V for the
LCD panel power (default)
34
PVDD
Pins
Description
1-2
Enabled Mini PCIe slot.
3-4
Enabled Mini PCIe slot.
29
JP_USBME_SEL
Note: For [29] JP_USBME_SEL to be activated,
the [28] JP_USBP3_SEL function has to be
disabled.
Onboard Jumpers
Step 4
Secure the COMe-9X90 module using M2.5x4mm screw. Then apply the
thermal paste on top of the processor and chipset.
VUSB
1
2
VUSB
USBD_T2-
3
4
USBD_T3-
5
6
GND
7
8
GND
KEY
9
10 GND
USB2_2/3
8
1 +5V
2 +12V
3 GND
S_PWR2
12
1 +5V
2 +12V
3 GND
S_PWR1
13
Pins
Description
1-2
Select module SPI BIOS (default)
2-3
Select carrier board SPI BIOS
33
BIOS_DIS1
Copyright © 2013-2017 VIA Technologies, Inc. All rights reserved.
Pins
Description
1-2
ATX mode (default)
2-3
AT mode
25
JP_AT/ATX_SEL5
Pins
Description
1-2
ATX mode (default)
2-3
AT mode
26
JP_AT/ATX_SEL2
Pins
Description
1-2
ATX mode (default)
2-3
AT mode
27
JP_AT/ATX_SEL3
Pins
Description
1-2
ATX mode (default)
2-3
AT mode
32
JP_AT/ATX_SEL4
Pins
Description
1-2
+3.3V (default)
2-3
+5V
31
EDID_PWR
Pins Description
1-2
ATX mode (default)
2-3
AT mode
35
JP_AT/ATX_SEL1
Note:
Due to the limitation of component height at the bottom side of COMe-9X90,
the SODIMM memory module installed in this side (SODIMM2 slot) cannot
be bundled with heatsink or thermal pad.
