11
GENERAL INTRODUCTION
Environment
Operating Temperature • 35W TDP CPU (i7-6700TE, i5-6500TE, i3-6100TE) :
-40°C to 75°C (-40°F to 167°F)
• 65W TDP CPU (i7-6700/ i5-6500/ i3-6100) :
-40°C to 55°C (-40°F to 131°F)
Storage Temperature
-40°C to 85°C (-40°F to 185°F)
Humidity
5% to 95% Humidity, non-condensing
Relative Humidity
95% at 70°C
Shock
• IEC 60068-2-27
• SSD : 50G @ Wallmount, Half-sine, 11ms
Vibration
• IEC 60068-2-64
• SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC
CE, FCC, EN50155, EN50121-3-2
1.3.5 Specifications of E
cho-236F
-
G
6
System
Processor
Intel
®
Core™ i7-6700/ i7-6700TE/ i5-6500/ i5-6500TE/
i3-6100/ i3-6100TE Processor (Skylake-S)
Chipset
Intel
®
C236
BIOS
AMI
SIO
IT8786E
Memory
• DDR4 2133MHz
• Up to 32GB
• 2 260-pin SO-DIMM Socket
I/O Interface
Serial
4 COM RS-232/ 422/ 485 w/ auto flow control
USB
• 6 USB 3.0 (External)
• 1 USB 2.0 (Internal)
Isolated DIO
16 Isolated DIO (8 DI, 8 DO)
LED
Power, HDD, Wireless
SIM Card
3 SIM Card Socket (External)
Expansion
Mini PCIe
3 Mini PCIe Socket :
• 2 Full-size for PCIe/ USB/ External SIM Card/ mSATA
• 1 Half-size for PCIe/ USB 3.0/ External SIM Card
