ZED-F9R - Integration manual
Figure 44: RF input trace
The RF_IN trace on the top layer should be referenced to a suitable ground layer.
4.8.4.2 Vias for the ground pads
The ground pads under the ZED-F9R high precision sensor fusion receiver need to be grounded
with vias to the lower ground layer of the PCB. A solid ground layer fill on the top layer of the PCB is
recommended. This is shown in the figure below.
Figure 45: Top layer fill and vias
4.8.4.3 VCC pads
The VCC pads for the ZED-F9R high precision sensor fusion receiver must have as low impedance
as possible with large vias to the lower power layer of the PCB. The VCC pads need a large combined
pad and the de-coupling capacitors must be placed as close as possible. This is shown in the figure
below.
UBX-20039643 - R01
4 Design
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