SAM-M10Q - Integration manual
0.2 mm
Figure 22: Example of thermal relief in a GND pad
Care must also be exercised with placing the receiver in proximity to circuitry that can emit heat.
Temperature-sensitive components inside the module, like TCXOs, are sensitive to sudden changes
in ambient temperature which can adversely impact satellite signal tracking. Sources can include
co-located power devices, cooling fans or thermal conduction via the PCB.
The GND planes can conduct heat to other elements, but they can act as heat dissipators as well.
Increasing the number of GND vias helps to decrease sudden temperature changes.
High temperature drift and air vents can affect the GNSS performance. For best
performance, avoid high temperature drift and air vents near the module.
3.4.1 Package footprint, copper and solder mask
shows the footprint of the SAM-M10Q form factor. The suggested solder mask opening
is 0.1 mm wider than the pad dimensions, as shwon in
UBX-22020019 - R01
3 Hardware integration
Page 59 of 72
C1-Public
