LISA-U1 series - System Integration Manual
3G.G2-HW-10002-3
Preliminary
Design-In
Page 99 of 125
2.2.2
Footprint and paste mask
The following figure describes the footprint and provides recommendations for the paste mask for LISA-U1 series
modules. These are recommendations only and not specifications. Note that the copper and solder masks have
the same size and position.
33
.2
m
m
[13
07
.1
m
il]
22.4 mm [881.9 mil]
2.
3
mm
[90
.6
m
il]
0.
8
mm
[31
.5
m
il]
1
.1
mm
[4
3
.3
m
il]
0.
8
mm
[31
.5
m
il]
1.0 mm
[39.3 mil]
5.7 mm
[224.4 mil]
33
.2
m
m
[13
07
.1
m
il]
22.4 mm [881.9 mil]
2.
3
mm
[90
.6
m
il]
1.
2
mm
[47
.2
m
il]
1
.1
mm
[4
3
.3
m
il]
0.
8
mm
[31
.5
m
il]
0.9 mm
[35.4 mil]
5.7 mm
[224.4 mil]
0.
6
mm
[23
.6
m
il]
Stencil: 120 µm
Figure 52: LISA-U1 series modules suggested footprint and paste mask
To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the
volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent)
extending beyond the copper mask. The solder paste should have a total thickness of 120 µm.
The paste mask outline needs to be considered when defining the minimal distance to the next
component.
The exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the
specific production processes (e.g. soldering etc.) of the customer.
The bottom layer of LISA-U1 series modules shows an unprotected copper area for GND described in Figure 53.
Consider “No-routing” area for the LISA-U1 series modules footprint as follows: signals keep-out area
on the top layer of the application board, below LISA-U1 series modules, due to GND opening on
module bottom layer (see Figure 53).
