LISA-U1 series - System Integration Manual
3G.G2-HW-10002-3
Preliminary
Design-In
Page 100 of 125
5.3 mm
11.85 mm
33
.2
m
m
1.0 mm
1.4 mm
PIN 1
Bottom side
(through module view)
22.40 mm
Exposed GND on LISA module bottom layer
Signals keep-out area on application board
Figure 53: Signals keep-out area on the top layer of the application board, below LISA-U1 series modules
2.2.3
Placement
Optimize placement for minimum length of RF line and closer path from DC source for
VCC
.
The heat dissipation during continuous transmission at maximum power can significantly raise the
temperature of the application base-board below the LISA-U1 series modules: avoid placing temperature
sensitive devices (e.g. GPS receiver) close to the module.
