ANNA-B112 - System integration manual
UBX-18009821 - R09
Handling and soldering
Page 50 of 66
C1-Public
The module is compatible with industrial reflow profile for RoHS solders. Use of "No Clean" soldering
paste is strongly recommended.
The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer
efficiency of the oven and particular type of solder paste used. The optimal soldering profile used has
to be trimmed for each case depending on the specific process and PCB layout.
Process parameter
Unit
Value
Pre-heat
Ramp up rate to
T
SMIN
K/s
3
T
SMIN
°C
150
T
SMAX
°C
200
t
S
(from 25 °C)
s
110
t
S
(Pre-heat)
s
60
Peak
T
L
°C
217
t
L
(time above
T
L
)
s
60
T
P
(absolute max)
°C
245
t
P
(time above
T
P
-5 °C)
s
10
Cooling
Ramp-down from
T
L
K/s
6
General
T
to peak
s
300
Allowed reflow soldering cycles
-
2
Table 16: Recommended reflow profiles
Figure 28: Reflow profile
☞
Lower value of T
P
and slower ramp down rate (2 – 3 °C/sec) is preferred.
☞
After reflow soldering, optical inspection of the module is recommended to verify proper
alignment.
⚠
Target values in Table 16 should be taken as general guidelines for a Pb-free process. Refer to
JEDEC J-STD-020C [6] standard for further information.
