SARA-R4 series - System Integration Manual
UBX-16029218 - R06
Design-in
Page 74 of 102
2.11
Module footprint and paste mask
Figure 41 and Table 30 describe the suggested footprint (i.e. copper mask) and paste mask layout for SARA
modules: the proposed land pattern layout reflects the modules’ pins layout, while the proposed stencil
apertures layout is slightly different (see the F’’, H’’, I’’, J’’, O’’ parameters compared to the F’, H’, I’, J’, O’ ones).
The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type,
implementing the solder mask opening 50 µm larger per side than the corresponding copper pad.
The recommended solder paste thickness is 150 µm, according to application production process requirements.
K
M1
M1
M2
E
G
H’
J’
E
ANT pin
B
Pin 1
K
G
H’
J’
A
D
D
O’
O’
L
N
L
I’
F’
F’
K
M1
M1
M2
E
G
H’’
J’’
E
ANT pin
B
Pin 1
K
G
H’’
J’’
A
D
D
O’’
O’’
L
N
L
I’’
F’’
F’’
Stencil: 150
µm
Figure 41: SARA-R4 series modules suggested footprint and paste mask (application board top view)
Parameter
Value
Parameter
Value
Parameter
Value
A
26.0 mm
G
1.10 mm
K
2.75 mm
B
16.0 mm
H’
0.80 mm
L
2.75 mm
C
3.00 mm
H’’
0.75 mm
M1
1.80 mm
D
2.00 mm
I’
1.50 mm
M2
3.60 mm
E
2.50 mm
I’’
1.55 mm
N
2.10 mm
F’
1.05 mm
J’
0.30 mm
O’
1.10 mm
F’’
1.00 mm
J’’
0.35 mm
O’’
1.05 mm
Table 30: SARA-R4 series modules suggested footprint and paste mask dimensions
These are recommendations only and not specifications. The exact copper, solder and paste mask
geometries, distances, stencil thicknesses and solder paste volumes must be adapted to the specific
production processes (e.g. soldering etc.) of the customer.
