SAM-M8Q - Hardware Integration Manual
UBX-16018358 - R05
Production Information
Contents
Page 4 of 23
Contents
Preface ................................................................................................................................ 3
Contents .............................................................................................................................. 4
1
Hardware description .................................................................................................. 5
1.1
Overview ................................................................................................................................................................................. 5
1.2
Configuration .......................................................................................................................................................................... 5
1.3
Connecting power ................................................................................................................................................................... 5
1.4
Interfaces ................................................................................................................................................................................. 6
1.4.1
UART .................................................................................................................................................................................. 6
1.4.2
Display Data Channel (DDC) ................................................................................................................................................. 6
1.5
I/O pins .................................................................................................................................................................................... 7
1.5.1
RESET_N: Reset .................................................................................................................................................................... 7
1.5.2
EXTINT: External interrupt .................................................................................................................................................... 7
1.5.3
TIMEPULSE .......................................................................................................................................................................... 7
1.5.4
SAFEBOOT_N ...................................................................................................................................................................... 7
1.6
Electromagnetic interference on I/O lines ................................................................................................................................... 8
2
Design ........................................................................................................................... 9
2.1
Pin description ......................................................................................................................................................................... 9
2.2
Minimal design ........................................................................................................................................................................ 9
2.3
Footprint and paste mask ....................................................................................................................................................... 10
2.4
Antenna ................................................................................................................................................................................ 11
2.5
Embedded antenna operation................................................................................................................................................. 12
2.6
PCB layout suggestion ............................................................................................................................................................ 13
3
Product handling ........................................................................................................ 14
3.1
Packaging, shipping, storage and moisture preconditioning ..................................................................................................... 14
3.2
Soldering ............................................................................................................................................................................... 14
3.3
EOS/ESD/EMI precautions ....................................................................................................................................................... 17
3.3.1
Electromagnetic interference (EMI) ..................................................................................................................................... 18
3.4
Applications with cellular modules .......................................................................................................................................... 19
Appendix .......................................................................................................................... 21
A
Glossary ...................................................................................................................... 21
B
Recommended parts .................................................................................................. 21
Related documents........................................................................................................... 22
Revision history ................................................................................................................ 22
Contact .............................................................................................................................. 23
