NINA-B1 series - System Integration Manual
UBX-15026175 - R09
Contents
Page 4 of 49
3.2
Antenna interface ............................................................................................................................... 28
3.2.1
RF transmission line design (NINA-B111 only) .............................................................................. 28
3.2.2
Antenna design (NINA-B111 only) ............................................................................................... 30
3.2.3
On-board antenna design (NINA-B112 only) ................................................................................ 32
3.3
Supply interfaces ................................................................................................................................ 33
3.3.1
Module supply design ................................................................................................................. 33
3.4
Data communication interfaces .......................................................................................................... 33
3.4.1
Asynchronous serial interface (UART) design ............................................................................... 33
3.4.2
Serial peripheral interface (SPI) ..................................................................................................... 34
3.4.3
I
2
C interface................................................................................................................................. 34
3.5
NFC interface ...................................................................................................................................... 34
3.5.1
Battery protection ....................................................................................................................... 34
3.6
General High Speed layout guidelines ................................................................................................. 35
3.6.1
General considerations for schematic design and PCB floor-planning .......................................... 35
3.6.2
Module placement ...................................................................................................................... 35
3.6.3
Layout and manufacturing .......................................................................................................... 35
3.7
Module footprint and paste mask ....................................................................................................... 36
3.8
Thermal guidelines.............................................................................................................................. 36
3.9
ESD guidelines .................................................................................................................................... 36
4
Handling and soldering ............................................................................................. 38
4.1
Packaging, shipping, storage and moisture preconditioning ............................................................... 38
4.2
Handling ............................................................................................................................................. 38
4.3
Soldering ............................................................................................................................................ 38
4.3.1
Reflow soldering process ............................................................................................................. 38
4.3.2
Cleaning ...................................................................................................................................... 39
4.3.3
Other remarks ............................................................................................................................. 40
5
Qualifications and approvals ..................................................................................... 41
6
Product testing ........................................................................................................... 42
6.1
u-blox In-Series production test .......................................................................................................... 42
6.2
OEM manufacturer production test .................................................................................................... 42
6.2.1
“Go/No go” tests for integrated devices ...................................................................................... 43
Appendix .......................................................................................................................... 44
A
Glossary ...................................................................................................................... 44
B
Antenna reference designs ........................................................................................ 45
B.1.1 Floor plan ......................................................................................................................................... 46
Related documents........................................................................................................... 48
Revision history ................................................................................................................ 48
Contact .............................................................................................................................. 49
