LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3
Preliminary
Revision history
Page 122 of 125
Revision history
Revision Date
Name
Status / Comments
-
Apr. 30, 2009
tgri
Initial release. Objective specification
A
Jun. 22, 2009
lpah
New CI
A1
Jul. 16, 2009
tgr
Change of document status to advance information
B
Aug. 20, 2009
lpah
Figure 1.1 and Figure 1.2: corrected the LEON block diagram
Figure 1.17: corrected the SIM Application circuit
Document updated for serial port handling
Table 1: renamed pins and description
Chapter 1.9.1: added the figures related to DSR behavior at power-on, RI behavior at SMS
Arrival, RI behavior at incoming call and CTS handling in power saving mode
C
Nov. 04, 2009
tgri/lpah/sses
este/fves
Change of document status to Preliminary. Revision of 2.2.2 footprint and paste mask, 2.2.3
paste mask removed
Section 1.5.2completely revised. Added Table 3, updated section 1.5.3.1
Section 1.5.4: added charging temperature range values with clarification
Section 1.5.5: added clarification regarding V_BCKP current consumption; added formula to
evaluate external capacitor capacitance requirement as function of the buffering time;
updated application circuits.
Updated Figure 17
Section 1.6.1: added Figure 19: Power on sequence description
Section 1.6.2: added clarification regarding the application circuit to avoid an increase of the
module current consumption in power down mode and added the power off sequence
diagram
Added Figure 20: Power off sequence description
Section 1.6.3: added RESET_N equivalent circuit description
Updated Figure 21: Application circuits to reset the module using a push button or using an
application processor
Section 1.10.1.3: clarified and updated application circuit description to connect a handset;
added application circuit description to connect an external audio device with analog
input/outputs; clarified and updated application circuit description to connect a headset.
Added Figure 20. Section 1.10.1.5: clarified and updated application circuit description in
hands free mode
Section1.10.2: added clarification regarding the application circuit to avoid an increase of the
module current consumption in power down mode. Section 1.8: clarified and updated
application circuit description for the SIM card. Section 1.9.1: corrected MAX3237
description; added clarification regarding the application circuit to avoid an increase of the
module current consumption in power down mode. Section 1.10: clarified as the measured
value is input impedance dependent
Section 1.12: added clarification regarding the application circuit to avoid an increase of the
module current consumption in power down mode.
Updated section 2.1: Check UART signals direction, since the signal names follow the ITU-T
V.24 Recommendation.
Added section 2.3 to explain module thermal resistance. Section 1.9.1: corrected supported
UART frame format. Corrected and improved description Updated and improved Figure 3:
Power supply concept
Added VCC extended and normal operating ranges description and clarified DC power supply
requirements in section 1.5.2
Updated and improved Figure 7 content and caption
Clarified current profile description in section 1.5.3.2
Updated and improved content and caption
Clarified charger requirements in section 1.5.4
Grouped sections Module power on, Module power off, Module reset into the 1.6 System
