LARA-R2 series - System Integration Manual
UBX-16010573 - R02
Objective Specification
Design-in
Page 119 of 148
2.9
Reserved pins (RSVD)
LARA-R2 series modules have pins reserved for future use, marked as
RSVD
. All the
RSVD
pins are to be left
unconnected on the application board except the following
RSVD
pin, as described in Figure 65:
the
RSVD
pin number
33
that must be externally connected to ground
LARA-R2
33
RSVD
RSVD
Figure 65: Application circuit for the reserved pins (RSVD)
2.10
Module placement
Optimize placement for minimum length of RF line and closer path from DC source for
VCC
.
Make sure that the module, RF and analog parts / circuits are clearly separated from any possible source of
radiated energy, including digital circuits that can radiate some digital frequency harmonics, which can produce
Electro-Magnetic Interference affecting module, RF and analog parts / circuits’ performance or implement proper
countermeasures to avoid any possible Electro-Magnetic Compatibility issue.
Make sure that the module, RF and analog parts / circuits, high speed digital circuits are clearly separated from
any sensitive part / circuit which may be affected by Electro-Magnetic Interference or employ countermeasures to
avoid any possible Electro-Magnetic Compatibility issue.
Provide enough clearance between the module and any external part.
The heat dissipation during continuous transmission at maximum power can significantly raise the
temperature of the application base-board below the LARA-R2 series modules: avoid placing temperature
sensitive devices close to the module.
