ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd.
15
V1.0.1
Figure 6-5 Layout of the PCB to which ZS3L applies
6.3 Production Instructions
1.
Use an SMT placement machine to mount the stamp hole module that Tuya produces
onto the PCB within 24 hours after the module is unpacked and the firmware is
burned. If not, vacuum pack the module again. Bake the module before mounting it
onto the PCB.
(1)
SMT placement equipment
i.
Reflow soldering machine
ii.
Automated optical inspection (AOI) equipment
iii.
Nozzle with a 6 mm to 8 mm diameter
(2)
Baking equipment
i.
Cabinet oven
ii.
Anti-static heat-resistant trays
iii.
Anti-static heat-resistant gloves
2.
Storage conditions for a delivered module are as follows:
(1)
The moisture-proof bag is placed in an environment where the temperature is
below 30°C and the relative humidity is lower than 70%.
