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• b) Automated optical inspection (AOI) equipment
• c) Nozzle with a 6 mm to 8 mm diameter
B. Baking equipment
-
a) Cabinet oven
-
b) Anti
-
static heat
-
resistant trays
-
c)
Anti
-
static heat
-
resistant gloves
2. Storage conditions for a delivered module are as follows:
• The moisture
-
proof bag must be placed in an environment where the temper
ature is below 30°C and the relative humidity is lower than 70%.
• The shelf life of a dry
-
packaged product is 6 months from the date when the
product is packaged and sealed.
• The package contains a humidity indicator card (HIC).
3. Bake a module based on HIC status as follows when you unpack the module
package:
• A. If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
hours.
• B. If the 30% circle is pink, bake the module for 4 consecutive hours.
• C. If the 30% and 40% circles are pink, bake the module for 6 consecutive
hours.
• D. If the 30%, 40%, and 50% circles are blue, bake the module for 12 consec
utive hours.
4. Baking settings:
• A. Baking temperature: 125±5°C
• B. Baking time: 130°C
• C. SMT placement ready temperature after natural cooling: < 36°C
• D. The number of drying times: 1
• E. Rebaking condition: The module is not soldered within 12 hours after baking.
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5. Do not use SMT to process modules that have been unpacked for more than
