V200
M1294
SEE LAYOUT DIAGRAM
PRODUCTION NOTES
1. DO NOT STUFF the headphone circuit parts that have a large 'X'
through them. The DNS parts also have X shown on the
actual board on the silkscreen legend.
2. Lay C126 flat before RTVing.
3. Bend C21X as flat as possible towards components
R210X and X34 before RTVing.
4. Wave solder in the indicated direction.
5. YCS90 ONLY
T&R, Remove R256 and R257.
6. BREAK PANEL IN TWO BEFORE CLINCHING WHERE INDICATED.
7. PCBSA: DO NOT BREAK OUT BOARD BEFORE TESTING.
PC# 7446
ONLY FOR YCS90
T&R REMOVE R256 AND R257
Summary of Contents for YCS50
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