User's Manual l TQMa8XxS UM 0101 l © 2022, TQ-Systems GmbH
Page 37
Figure 36: TQMa8XxS, component placement bottom
The labels on the TQMa8XxS show the following information:
Table 23:
Labels on TQMa8XxS
Label
Content
AK1 (on D4)
First MAC address plus one additional reserved consecutive MAC address, tests performed
AK2 (on D14)
TQMa8XxS version and revision
AK3 (on D2)
Serial number
4.4
Adaptation to the environment
The TQMa8XxS has overall dimensions (length × width) of 82 mm × 50 mm (± 0,1 mm).
The TQMa8XxS has a minimum height above the carrier board of 5.02 mm (± 0,2 mm) (depends on connector on carrier board).
The TQMa8XxS weighs approximately 17 g.
4.5
Protection against external effects
As an embedded module, the TQMa8XxS is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system.
4.6
Thermal management
To cool the TQMa8XxS, a maximum of approximately 4 watts must be dissipated, see Table 17 for peak currents.
The cooling solution must be able to dissipate this power peak; it will never occur permanently in normal operation.
The power dissipation originates primarily in the i.MX 8X, the DDR3L SDRAM and the PMIC.
The power dissipation also depends on the software used and can vary according to the application.
See i.MX 8X Data Sheet (1) for further information.
