User's Manual l MBLS1028A UM 0100 l © 2020, TQ-Systems GmbH
Page 31
6.2
Notes of treatment
The TQMLS1028A is held in its mating connectors with a retention force of approximately 24 N.
To avoid damage caused by mechanical stress, the TQMLS1028A may only be extracted from the MBLS1028A by using the
extraction tool MOZI8XX that can be obtained separately.
Note: Component placement on carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the MBLS1028A
for the extraction tool MOZI8XX.
6.3
Embedding in the overall system
The MBLS1028A serves as a design base for customer products, as well as a platform to support during development.
6.4
Housing
The form factor and the mounting holes of the MBLS1028A are designed for installation in a standard EURO housing.
6.5
Thermal management
The MBLS1028A has a maximum peak power consumption of approximately 3 watts. Further power loss occurs mainly at
externally connected devices.
Attention: TQMLS1028A heat dissipation
The LS1028A CPU belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad,
heatsink) as well as the maximum pressure on the TQMLS1028A must be taken into consideration
when connecting the heat sink.
The TQMLS1028A is not the highest component. Inadequate cooling connections can lead to
overheating of the TQMLS1028A or the MBLS1028A and thus malfunction, deterioration or
destruction.
