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MT8206
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK
CONFIDENTIAL, NO DISCLOSURE
June, 2006
13.BOM of lead free package
Supplied by SPIL Inc.
Substrate: PPT/Nayan/Kinsus
S/E: ABLEBOND 2000
Bonding wire: gold
M/C: PLASKON NXG-1FP
Solder ball: Sn/Ag/Cu: 95.5/ 4/ 0.5%
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Summary of Contents for 42M61NF21
Page 81: ...7 PCB Layout All manuals and user guides at all guides com a l l g u i d e s c o m...
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