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Appendix A
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Table 1. TUSB7320 DEMO REVB BOM (continued)
Item
Quantity
Reference
Part
Footprint
Tolerance
Manufacturer
Manufacturer PN
40
3
R38,R39,R50
0
402
5%
41
1
U1
TUSB7320QFN
100_QFN
TI
TUSB7320QFN
42
1
U2
24LC01_NF
8_SOIC
MicroChip Tech
24LC01BT-I/SN
43
1
U3
TPS2560DRC
10_DRC
TI
TPS2560DRC
44
1
U5
TPS74401RGWT
20_RGW
TI
TPS74401RGWT
45
1
U6
TPS5450_NF
DDA
TI
TPS5450DDAR
46
2
U26,U27
TPD2EUSB30
DRT_sot23
TI
TPD2EUSB30DRT
ABM3B-48.000MHZ-
47
1
Y1
ECS-48MHZ
ECX-53B
Abracon
B2-T
4-40x1/4 Machine Screw
48
2
Digikey
H342-ND
Phillips
General Stamping
49
1
PCI Bracket
& Manufacturing
ME-440-2AT-BB
Corp.
50
1
J26,J40
Jump Shunt
Tyco
881545-2
The below table is the bill of materials for the TUSB7340 DEMO EVM REVB board. The rows marked in
yellow are components that are not populated on the EVM board.
Table 2. TUSB7340 DEMO REVB BOM
Item
Quantity
Reference
Part
Footprint
Tolerance
Manufacturer
Manufacturer PN
C1,C6,C8,C9,C11,C13,
C14,C16,C17,C19,C20,
C22,C23,C25,C26,C27,
C28,C29,C31,C32,C34,
1
44
C35,C37,C38,C39,C40,
0.1µF
402
C41,C43,C45,C47,C48,
C49,C51,C52,C54,C56,
C57,C58,C60,C61,C65,
C67,C68, C85
2
2
C2,C3
18pF
402
3
3
C4,C24,C70
22µF
805
C5,C7,C10,C12,C15,
4
11
C18,C21,C30,C33,C36,
0.01µF
402
C71
5
4
C42,C50,C59,C66
0.001µF
402
6
4
C44,C46,C53,C55
150µF
CASE_D
Panasonic
EEEFP1A151AP
7
1
C62
NOPOP
1210
8
1
C63
NOPOP
805
9
2
C64,C76
22µF
1210
10
1
C69
10µF
805
11
1
C72
NOPOP
402
12
1
C73
330µF_NF
THCAP_2P5MM
Panasonic
ECA-1CM331
13
3
C74,C75,C78
0.01µF_NF
402
14
1
C77
22µF_NF
1210
15
1
C79
1000pF
402
16
1
C80
NOPOP
7343
XX
XX
17
5
D1,D2,D3,D4,D5
LED Green 0805
805
Lumex
SML-LX0805GC-TR
18
1
D6
MBRS540T3_NF
DIODE_SMC
On Semiconductor
MBRS540T3G
19
1
FB1
220 @ 100MHZ
603
MuRata
BLM18EG221SN1D
20
4
J1,J2,J3,J4
USB3_TYPEA
USB3_TYPEA
MainSuper
AK2SA009K1
21
1
J5
IDE_PWR_CONN
IDEPWR
Molex
15-24-4441
22
2
J22,J26
HDR2X1 M .1
HDR_2X1
23
1
J27
NOPOP
HDR_2X1
24
1
J40
HDR1x3
berg1x3
22
Bill of Materials
SLLU146C – May 2011 – Revised May 2014
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