Texas Instruments TRF1208-EVM, User Manual, Page: 7 / 17

2.4 Stack-Up and Material
The TRF1208 EVM is a 67-mil, 4-layer board whose material type is Isola ® 370HR. The top layer routes the
power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground
layer. The signal trace impedance is targeted at 50Ω. The bottom 3 layers are ground layers.
Figure 2-6. TRF1208 EVM Stack-Up (Units in Mils)
www.ti.com EVM Overview
SBOU266 – SEPTEMBER 2021
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TRF1208 Evaluation Module 7
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