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2.4 Stack-Up and Material
The TRF0206-SP EVM is a 67-mil, 4-layer board whose material type is Isola
®
185HR. The top layer routes the
power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground
layer. The signal trace impedance is targeted at 50 Ω. The bottom 3 layers are ground layers.
Figure 2-6. TRF0206-SP EVM Stack-Up (Units in Mils)
EVM Overview
SLAU877 – OCTOBER 2022
TRF0206-SP Evaluation Module
7
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