Texas Instruments TPS7A13EVM-057 User Manual Download Page 14

STANDARD TERMS FOR EVALUATION MODULES

1.

Delivery:

TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1

EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2

EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2

Limited Warranty and Related Remedies/Disclaimers

:

2.1

These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.

2.2

TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques

are

used

to

the

extent

TI

deems

necessary.

TI

does

not

test

all

parameters

of

each

EVM.

User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3

TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

WARNING

Evaluation Kits are intended solely for use by technically qualified,

professional electronics experts who are familiar with the dangers

and application risks associated with handling electrical mechanical

components, systems, and subsystems.

User shall operate the Evaluation Kit within TI’s recommended

guidelines and any applicable legal or environmental requirements

as well as reasonable and customary safeguards. Failure to set up

and/or operate the Evaluation Kit within TI’s recommended

guidelines may result in personal injury or death or property

damage. Proper set up entails following TI’s instructions for

electrical ratings of interface circuits such as input, output and

electrical loads.

NOTE:

EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

Summary of Contents for TPS7A13EVM-057

Page 1: ...a schematic diagram and a bill of materials BOM Throughout this document the terms evaluation board evaluation module and EVM are synonymous with the TPS7A13EVM 057 Table of Contents 1 Trademarks 2 2...

Page 2: ...Assembly Layer and Silk Screen 9 Figure 4 2 Top Layer Routing 9 Figure 4 3 Layer 2 9 Figure 4 4 Layer 3 9 Figure 4 5 Bottom Layer Routing 10 Figure 4 6 Bottom Assembly Layer and Silk Screen 10 Figure...

Page 3: ...und connection 3 1 3 VOUT and GND VOUT and GND are the connection terminals for the output load The VOUT terminal is the positive connection and the GND terminal is the negative that is ground connect...

Page 4: ...ncy kelvin connection that allows accurate measurements of the load transient MOSFET gate to source voltage 3 2 8 TP2 TP3 and TP4 TP2 TP3 and TP4 allow the user to measure the gate drive resistances R...

Page 5: ...header 1 Place a 2 pin shunt across the header to tie VIN to EN to enable the device 2 Place a 2 pin shunt across the header to tie GND to EN to disable the device Alternatively by connecting an exter...

Page 6: ...urrent probes a 10 AWG wire can be used WARNING The sensors of some current probes are tied to GND and cannot come into contact with energized conductors See the user manual of your current probe for...

Page 7: ...of 1 ms to prevent excessive heating of the pulsed resistors R2 R3 R4 R5 and R6 Configure a function generator for the 50 output in a 0 V DC to 5 V DC square pulse If necessary burst mode can be confi...

Page 8: ...4 TPS7A13EVM 057 Load Transient Results 300 mA to 1 mA Load Step Setup www ti com 8 TPS7A13EVM 057 Evaluation Module SBVU074 NOVEMBER 2021 Submit Document Feedback Copyright 2021 Texas Instruments Inc...

Page 9: ...LDO LMG1020YFFR gate driver and pulsed resistors R2 R3 R4 R5 and R6 are most at risk of raising to a high junction temperature during normal operation Figure 4 1 Top Assembly Layer and Silk Screen Fig...

Page 10: ...Layer Routing Figure 4 6 Bottom Assembly Layer and Silk Screen Board Layout www ti com 10 TPS7A13EVM 057 Evaluation Module SBVU074 NOVEMBER 2021 Submit Document Feedback Copyright 2021 Texas Instrume...

Page 11: ...50V 10uF C15 50V 10uF C14 1 00k R1 1 2 J13 50V 0 1uF C13 2 2 F 10V C2 10V 2 2uF C3 154 R5 154 R6 154 R4 154 R3 GND EN VIN EN VOUT 154 R2 100V 1pF C11 0 R11 0 R7 3 5 6 8 4 7 1 2 Q1 CSD17313Q2 1 2 3 4...

Page 12: ...anufacturing J18 1 SMA Straight Jack Gold 50 Ohm TH SMA Straight Jack TH 901 144 8RFX Amphenol RF Q1 1 30V MOSFET N CH 30 V 5 A DQK0006C WSON 6 DQK0006C CSD17313Q2 Texas Instruments None R8 1 2 49k RE...

Page 13: ...ht Jack TH 901 144 8RFX Amphenol RF J8 J10 0 Terminal Block 5 mm 2x1 Tin TH Terminal Block 5 mm 2x1 TH 691 101 710 002 Wurth Elektronik J13 0 Header 100mil 2x1 Gold TH Sullins 100mil 1x2 230 mil above...

Page 14: ...ther than TI b the nonconformity resulted from User s design specifications or instructions for such EVMs or improper system design or c User has not paid on time Testing and other quality control tec...

Page 15: ...These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not in...

Page 16: ...instructions set forth by Radio Law of Japan which includes but is not limited to the instructions below with respect to EVMs which for the avoidance of doubt are stated strictly for convenience and s...

Page 17: ...any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electr...

Page 18: ...R DAMAGES ARE CLAIMED THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT 9 Return Policy Except as otherwise provided TI does not offer any refunds returns or exchanges Furthe...

Page 19: ...change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of thes...

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