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5.2

Schematic and Bill of Materials

Board Layout, Schematic, and Bill of Materials

www.ti.com

Figure 3. Bottom Layer

Figure 4. TPS61220EVM-319 Schematic

Table 2. Bill of Materials

Count

RefDes

Value

Description

Size

Part Number

MFR

2

C1, C2

10

µ

F

Capacitor, Ceramic, 6.3 V, X5R, 20%

0603

GRM188R60J106ME47D

Murata

4

J1, J3,

PTC02SAAN

Header, Male 2-pin, 100-mil spacing

0.100

×

2 in. (2,54 x

PTC02SAAN

Sullins

J4, J6

50,80 mm)

0

J2, J5

Open

Header, Male 2-pin, 100-mil spacing

0.100

×

2 in. (2,54 x

Open

Sullins

50,80 mm)

1

JP1

PTC03SAAN

Header, 3-pin, 100-mil spacing

0.100

×

3 in. (2,54 x

PTC03SAAN

Sullins

76,20 mm)

1

L1

4.7

µ

H

Inductor Power, SMT, DCR 145 m

, 550 mA

0.110 x 0.118 in.

EPL3015-472ML

Coilcraft

(2,79 x 2,99 mm)

1

R1

1.00M

Resistor, Chip, 1/16 W, 1%

0603

Std

Std

1

R2

178k

Resistor, Chip, 1/16 W, 1%

0603

Std

Std

1

U1

TPS61220DCK

IC, Tiny Low Input Voltage Boost Converter

SC-70

TPS61220DCK

TI

1

Shunt, 100 mil, Black

0.100 in. (2,54 mm)

929950-00

3M

1

HPA319

PCB

0.9

×

1.7

×

0.062 in.

HPA319

Any

(22,86 x 43,18 x
1,57 mm)

4

TPS61220EVM-319

SLVU253 – February 2009

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Summary of Contents for TPS61220EVM-319

Page 1: ...ed between 1 8 V and 5 5 V by adjusting the value of R1 and R2 See Table 1 for common output voltages and recommended values for R1 and R2 also see data sheet SLVS776 for more information The board fe...

Page 2: ...s on the conversion ratio between input and output along with Vout consult the data sheet for additional information Configure jumper JP1 as required the EN pin is not pulled up or down inside the dev...

Page 3: ...www ti com Board Layout Schematic and Bill of Materials Figure 1 Top Assembly Layer Figure 2 Top Layer SLVU253 February 2009 TPS61220EVM 319 3 Submit Documentation Feedback...

Page 4: ...er Male 2 pin 100 mil spacing 0 100 2 in 2 54 x Open Sullins 50 80 mm 1 JP1 PTC03SAAN Header 3 pin 100 mil spacing 0 100 3 in 2 54 x PTC03SAAN Sullins 76 20 mm 1 L1 4 7 H Inductor Power SMT DCR 145 m...

Page 5: ...be observed 2 These assemblies must be clean and free from flux and all contaminants Use of no clean flux is not acceptable 3 These assemblies must comply with workmanship standards IPC A 610 Class 2...

Page 6: ...ncy energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES 003 rules which are designed to provide reasonable protection against radio fr...

Page 7: ...na type and its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication This radio transmitter has been approved...

Page 8: ...egulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided...

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