5.2
Schematic and Bill of Materials
Board Layout, Schematic, and Bill of Materials
www.ti.com
Figure 3. Bottom Layer
Figure 4. TPS61220EVM-319 Schematic
Table 2. Bill of Materials
Count
RefDes
Value
Description
Size
Part Number
MFR
2
C1, C2
10
µ
F
Capacitor, Ceramic, 6.3 V, X5R, 20%
0603
GRM188R60J106ME47D
Murata
4
J1, J3,
PTC02SAAN
Header, Male 2-pin, 100-mil spacing
0.100
×
2 in. (2,54 x
PTC02SAAN
Sullins
J4, J6
50,80 mm)
0
J2, J5
Open
Header, Male 2-pin, 100-mil spacing
0.100
×
2 in. (2,54 x
Open
Sullins
50,80 mm)
1
JP1
PTC03SAAN
Header, 3-pin, 100-mil spacing
0.100
×
3 in. (2,54 x
PTC03SAAN
Sullins
76,20 mm)
1
L1
4.7
µ
H
Inductor Power, SMT, DCR 145 m
Ω
, 550 mA
0.110 x 0.118 in.
EPL3015-472ML
Coilcraft
(2,79 x 2,99 mm)
1
R1
1.00M
Resistor, Chip, 1/16 W, 1%
0603
Std
Std
1
R2
178k
Resistor, Chip, 1/16 W, 1%
0603
Std
Std
1
U1
TPS61220DCK
IC, Tiny Low Input Voltage Boost Converter
SC-70
TPS61220DCK
TI
1
—
—
Shunt, 100 mil, Black
0.100 in. (2,54 mm)
929950-00
3M
1
HPA319
PCB
0.9
×
1.7
×
0.062 in.
HPA319
Any
(22,86 x 43,18 x
1,57 mm)
4
TPS61220EVM-319
SLVU253 – February 2009