2-3
EVM Description
2.2
EVM Layout
Figure 2−2. EVM Board Layout
Figure 2−2 shows the placement of the components of the EVM. Components
are only placed on the top layer of the board. The size of the EVM is
42,0 x 33,0 mm
2
(1386 mm
2
), which is much larger than required for the IC
and its capacitors.
The total space required for the IC and the capacitors on the EVM is only about
8 mm
×
10 mm = 80 mm
2
. The capacitors are not optimized for space, but are
optimized for performance. It is possible to use smaller capacitors to optimize
the layout for minimum board space. On the EVM, it is also possible to solder
other capacitors because the 1206-size pads have been added in parallel to
C
IN
, C
OUT
, and C
FLY
.
The signal on the bottom is the ground signal (GND). For good performance,
the entire bottom layer is one GND plane, only interrupted by some vias.
Figure 2−3 shows the board layers.
Figure 2−3. EVM Board Layers
a) Top Layer (Size 1:1)
b) Bottom Layer (Mirrored, Size 1:1)