4 Board Layout
This section provides a description of the TPS543320EVM board layout and layer illustrations.
4.1 Layout
The board layout for the TPS543320EVM is shown in
EVM is laid out in a manner typical of a user application. The top, bottom, and internal layers are 2-oz. copper.
The small size U1 circuit takes up an area of only approximately 100 mm
2
as shown on the silkscreen.
All of the required components for the TPS543320 are placed on the top layer. The input decoupling capacitors,
BP5 capacitor, and bootstrap capacitor are all located as close to the IC as possible. Additionally, the voltage
set point resistor divider components are kept close to the IC. An additional input bulk capacitor is used near the
input terminal to limit the noise entering the converter from the supply used to power the board. Critical analog
circuits such as the voltage set point divider, EN resistor, MODE resistor, and FSEL resistor are kept close to the
IC and terminated to the quiet analog ground (AGND) island on the top layer.
The top layer contains the main power traces for VIN, VOUT, and SW. The top layer power traces are connected
to the planes on other layers of the board with multiple vias placed around the board. There are multiple vias
near the PGND pins of the IC to help maximize the thermal performance. Each TPS543320 circuit has its own
dedicated ground are for quiet analog ground that is connected to the main power ground plane at a single point.
This single point connection is done using vias to the internal ground planes. Lastly the voltage divider network
ties to the output voltage at the point of regulation, the copper V
OUT
area on the top layer.
The mid layer 1 is a large ground plane with as few traces as possible to minimize cuts in the ground plane. It is
especially important to minimize cuts in the ground plane near the IC to help with minimize noise and maximize
thermal performance.
The mid layer 2 contains a VIN copper area to connect both TPS543320 circuits to the input terminals. There is
also a VIN copper area beneath each IC to connect its VIN pins together with a low impedance connection. This
layer also has the trace to connect the FB divider to the output. Lastly, the remaining area of this layer is filled in
with PGND.
The bottom layer is primarily used for another ground plane. This layer also has an additional VOUT copper area
for the U2 circuit. Lastly, the load transient circuit is placed on this side of the EVM.
Figure 4-1. Top-Side Composite View
Figure 4-2. Bottom-Side Composite View (Viewed
From Bottom)
Board Layout
24
TPS543320 SWIFT™ Step-Down Converter Evaluation Module User's Guide
SLVUC07A – DECEMBER 2020 – REVISED MAY 2021
Copyright © 2021 Texas Instruments Incorporated
