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Bill of Materials
4-3
Bill of Materials
MFR
Part Number
Size
Description
RefDes
Count
0
U1
IC, TPS2375 Powered Device
Controller
TSSOP−8
TPS2375PW
TI
1
U2
IC, TPS2375 Powered Device
Controller
SO−8
TPS2375D
TI
4
Shunt
on JP0,JP5, JP6, & JP7, 2−pin,
0.100 cntr
STC02SYAN
Sullins
1
−−
PCB, 4.316 In
×
2.890 In
×
0.062 In
HPA028
Any
4
Rubber bumber
2566
SPC Tech.
Notes:
1) These assemblies are ESD sensitive, ESD precautions must be observed.
2) These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3) These assemblies must comply with workmanship standards IPC−A−610 Class 2.
4) Reference designators marked with an asterisk (**) cannot be substituted. All other components can be substituted-
with equivalent MFG’s components.
Summary of Contents for TPS2375EVM
Page 8: ...Contents viii...
Page 10: ...1 2 This page has been left blank intentionally...
Page 12: ...2 2 This page has been left blank intentionally...
Page 20: ...4 4...
Page 22: ...TPS2375 EVM Schematic 5 2 5 1 TPS2375 EVM Schematic...
Page 23: ...Layouts 5 3 Schematic and Layout 5 2 Layouts The board layout is shown on the following pages...
Page 24: ...Layouts 5 4 Figure 5 1 Top Assembly Layer...
Page 25: ...Layouts 5 5 Schematic and Layout Figure 5 2 Bottom Assembly Layer...
Page 26: ...5 6...