Texas Instruments TPA2035D1 User Manual Download Page 4

FUNCTIONAL BLOCK DIAGRAM

Input
Buffer

SC

300 KΩ

TPA2035D1

SLOS562 – AUGUST 2008

................................................................................................................................................................................................

www.ti.com

OPERATING CHARACTERISTICS (continued)

T

A

= 25°C, R

L

= 8

(unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

R

I

Input impedance

A

V

= 2 V/V

30.2

k

Start-up time from shutdown

V

DD

= 3.6 V

3.2

ms

Short circuit detection

V

DD

= 3.6 V

1.7

A

threshold

Terminal Functions

TERMINAL

I/O

DESCRIPTION

NAME

YZF

IN–

C1

I

Negative differential audio input

IN+

A1

I

Positive differential audio input

V

O-

A3

O

Negative BTL audio output

V

O+

C3

O

Positive BTL audio output

Analog ground terminal. Must be connected to same potential as PGND using a direct connection

GND

A2

I

to a single point ground.

High-current Analog ground terminal. Must be connected to same potential as GND using a direct

PGND

B3

connection to a single point ground.

Power supply terminal. Must be connected to same power supply as PV

DD

using a direct

V

DD

B1

I

connection. Voltage must be within values listed in Recommended Operating Conditions table.

High-current Power supply terminal. Must be connected to same power supply as V

DD

using a

PV

DD

B2

I

direct connection. Voltage must be within values listed in Recommended Operating Conditions
table.

SHUTDOWN

C2

I

Shutdown terminal. When terminal is low the device is put into Shutdown mode.

4

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TPA2035D1

Summary of Contents for TPA2035D1

Page 1: ...ellent PSRR and CMRR Features like 75dB PSRR and improved Optimized PWM Output Stage Eliminates RF rectification immunity with a small PCB footprint WCSP amplifier plus single decoupling cap make LC O...

Page 2: ...charge Tolerance Human Body Model HBM for all pins 2 2KV 1 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device These are stress ratings only and functi...

Page 3: ...VDD 2 5 V to 5 5 V 5 5 6 6 5 dB Resistance of internal pulldown RPD resistor from shutdown pin to 300 k GND TA 25 C RL 8 unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VDD 5 V 2 75...

Page 4: ...ntial as PGND using a direct connection GND A2 I to a single point ground High current Analog ground terminal Must be connected to same potential as GND using a direct PGND B3 connection to a single p...

Page 5: ...3 24 25 KSVR Supply voltage rejection ratio vs Frequency 26 27 vs Time 28 GSM power supply rejection vs Frequency 29 KSVR Supply voltage rejection ratio vs Common mode input voltage 30 31 32 vs Freque...

Page 6: ...DD P Output Power W O I Supply Current mA DD R 8 33 H L W 0 0 25 0 5 0 75 1 1 25 1 5 1 75 3 6 3 2 2 8 2 4 2 1 6 1 2 0 4 0 0 0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 V 2 5 V DD V 5 V DD V 3 6 V DD I Supply Cur...

Page 7: ...DD W P 50 mW O P 250 mW O 1 0 01 0 1 f Frequency Hz 20k 20 100 1k 10k V 2 5 V DD V 5 V DD V 4 V DD V 3 6 V DD V 3 V DD THD N Total Harmonic Distortion Noise R 4 L W 1 0 005 0 01 0 1 f Frequency Hz 20...

Page 8: ...1 1 5 2 2 5 3 3 5 4 4 5 5 DC Common Mode Voltage V Supply Ripple Rejection Ratio dB V 2 5 V DD V 3 6 V DD V 5 V DD 90 80 70 60 50 40 30 20 10 0 0 0 5 1 1 5 2 2 5 3 3 5 4 4 5 5 DC Common Mode Voltage V...

Page 9: ...5 60 10 100 1 k 10 k 100 k f Frequency Hz CMRR Common Mode Rejection Ratio dB V 3 6 V V 1 Vpp R 8 DD IC L W TPA2035D1 www ti com SLOS562 AUGUST 2008 COMMON MODE REJECTION COMMON MODE REJECTION RATIO R...

Page 10: ...1 goes to shutdown mode and tries to reactivate itself after 20 s This auto recovery will continue until the short circuit event stops This feature can protect the device without affecting the device...

Page 11: ...en into consideration when setting the corner frequency using input capacitors Equation 2 is reconfigured to solve for the input coupling capacitance If the corner frequency is within the audio band t...

Page 12: ...nput In making the pad size for the WCSP balls it is recommended that the layout use nonsolder mask defined NSMD land With this method the solder mask opening is made larger than the desired land area...

Page 13: ...with electro polishing Use of chemically etched stencils results in inferior solder paste volume control 7 Trace routing away from WCSP device should be balanced in X and Y directions to avoid uninte...

Page 14: ...Output Power figures the maximum ambient temperature can be calculated with the following equation Note that the units on these figures are Watts RMS Because of crest factor ratio of peak power to RM...

Page 15: ...ften be used in the design if failing radiated emissions testing without an LC filter and the frequency sensitive circuit is greater than 1 MHz If choosing a ferrite bead choose one with high impedanc...

Page 16: ...xempt This component has a RoHS exemption for either 1 lead based flip chip solder bumps used between the die and package or 2 lead based die adhesive used between the die and leadframe The component...

Page 17: ...D Max E Max 1 51 mm Min 1 51 mm Min 1 45 mm 1 45 mm...

Page 18: ...sponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related inf...

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