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General High-Speed Amplifier Design Considerations

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General Information

1.8

General High-Speed Amplifier Design Considerations

The THS7002 EVM layout has been designed and optimized for use with
high-speed signals and can be used as an example when designing THS7002
applications. Careful attention has been given to component selection,
grounding, power supply bypassing, and signal path layout. Disregard of these
basic design considerations could result in less than optimum performance of
the THS7002 dual differential line drivers and receivers IC.

Surface-mount components were selected because of the extremely low lead
inductance associated with this technology. Also, because surface-mount
components are physically small, the layout can be very compact. This helps
minimize both stray inductance and capacitance.

Tantalum power supply bypass capacitors (C4, C5, and C21) at the power
input pads help supply currents for rapid, large signal changes at the amplifier
output. The 0.1 

µ

F power supply bypass capacitors (C2, C3, C11, C12, C18,

and C19) were placed as close as possible to the IC power input pins in order
to keep the PCB trace inductance to a minimum. This improves
high-frequency bypassing and reduces harmonic distortion.

A proper ground plane on both sides of the PCB should always be used with
high-speed circuit design. This provides low-inductive ground connections for
return current paths. In the area of the preamplifier input pins, however, the
ground plane was removed to minimize stray capacitance and reduce ground
plane noise coupling into these pins. This is especially important for the
inverting pin while the amplifier is operating in the noninverting mode. Because
the voltage at this pin swings directly with the noninverting input voltage, any
stray capacitance would allow currents to flow into the ground plane, causing
possible gain error and/or oscillation. Capacitance variations at the amplifier
IC input pin of less than 1 pF can significantly affect the response of the
amplifier.

In general, it is always best to keep signal lines as short and as straight as
possible. Sharp 90

_

 corners should generally be avoided — round corners or

a series of 45

_

 bends should be used, instead. Stripline techniques should

also be incorporated when signal lines are greater than 3 inches in length.
These traces should be designed with a characteristic impedance of either 50

 or 75 

, as required by the application. Such signal lines should also be

properly terminated with an appropriate resistor.

Finally, proper termination of all inputs and outputs should be incorporated into
the layout. Unterminated lines, such as coaxial cable, can appear to be a
reactive load to the amplifier IC. By terminating a transmission line with its
characteristic impedance, the amplifier’s load then appears to be purely
resistive, and reflections are absorbed at each end of the line. Another
advantage of using an output termination resistor is that capacitive loads are
isolated from the amplifier output. This isolation helps minimize the reduction
in amplifier phase-margin and improves the amplifier stability for improved
performance such as reduced peaking and settling times.

Summary of Contents for THS7002

Page 1: ...THS7002 Programmable Gain Amplifier Evaluation Module July 1999 Mixed Signal Products User s Guide SLOU037...

Page 2: ...ONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH PERSONAL INJURY OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE CRITICAL APPLICATIONS TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED AUTHORIZED OR WARRANT...

Page 3: ...e THS7002 amplifier IC is supplied FCC Warning This equipment is intended for use in a laboratory test environment only It generates uses and can radiate radio frequency energy and has not been tested...

Page 4: ...iv...

Page 5: ...1 4 EVM DIP Switch Functionality 1 9 1 5 EVM Circuit Configuration 1 10 1 6 Using the THS7002 EVM 1 12 1 7 THS7002 EVM Performance 1 13 1 8 General High Speed Amplifier Design Considerations 1 16 1 9...

Page 6: ...onse 1 14 1 10 THS7002 EVM Preamplifier PGA Frequency Response 1 15 1 11 THS7002 EVM Preamplifier PGA Phase Response 1 15 1 12 PowerPAD PCB Etch and Via Pattern 1 17 1 13 Maximum Power Dissipation vs...

Page 7: ...iguring connecting and using the EVM and a discussion on high speed amplifier and PowerPAD package design considerations Topic Page 1 1 Features 1 2 1 2 Description 1 2 1 3 Programmable Gain Amplifier...

Page 8: ...in amplifier evaluation module EVM is a complete dual channel low noise receiver and a highly configurable programmable gain amplifier circuit It consists of the TI THS7002 Programmable Gain Amplifier...

Page 9: ...R11 R15 R14 R13 R35 R37 R39 R41 R23 R25 R27 R29 R11 R33 R10 C9 JP2 C14 1998 Texas Instruments J4 J3 J2 J1 SLOP136 Rev B THS7002 EVM Board R7 R8 C8 GND U2 Out 1 1 1 1 1 Input power is applied to the EV...

Page 10: ...EF SID Vcc VCC VH VL VO GND VIN 26 28 21 27 C18 0 1 F 15 V 13 14 25 22 R29 330 R18 49 9 R30 3 3 k 5 V S1 D S1 E AVREF TP8 AS D TP7 C19 0 1 F 15 V R23 330 R25 330 R27 330 R24 3 3 k R26 3 3 k R28 3 3 k...

Page 11: ...rational amplifier gain equations Inverting Gain R F R G 1 Non Inverting Gain 1 R F R G 2 The gain of these amplifiers can easily be changed to support different applications by changing the resistor...

Page 12: ...pin is high 5 V the corresponding preamplifier and PGA section is turned off Shutdowns on the EVM are controlled by switches S1 D A channel and S2 D B channel or by applying an external shutdown sign...

Page 13: ...nal Gain Attenuation G2 G1 G0 PGA Gain dB PGA Gain V V 0 0 0 22 0 08 0 0 1 16 0 16 0 1 0 10 0 32 0 1 1 4 0 63 1 0 0 2 1 26 1 0 1 8 2 52 1 1 0 14 5 01 1 1 1 20 10 One aspect of the THS7002 PGA signal i...

Page 14: ...of most ADCs the PGA outputs incorporate a voltage clamp Because the internal clamps use the same clamping reference voltages the outputs of both PGAs are clamped to the same values These clamps are...

Page 15: ...0 A Channel Shutdown Value 0 Low A Side Active S1 D A S D 1 A Channel Shutdown Value 1 High A Side Shutdown S1 E A VREF 0 A Channel VREF Floating Connect TP8 to Ext Ref S1 E A VREF 1 A Channel VREF Co...

Page 16: ...1 J 1 2 Connects the input of A channel PGA U1 B to the input A BNC J6 bypassing the THS7002 A channel preamplifier U1 A J 2 3 Connects the input of A channel PGA U1 B to the output of the A channel p...

Page 17: ...to Vcc when switch S2 F is set appropriately J 2 3 Connects the THS7002 IC positive clamp input pin VH to 5V when switch S2 F is set appropriately For example to use a single ended input and use the p...

Page 18: ...A A amplifier output BNC J9 Connecting directly to J9 with a 50 nominal impedance cable and probe is not recommended The output drive capability of the PGAs is very limited Such a connection will load...

Page 19: ...h a 15 V power supply is 100 MHz for the preamplifier in each channel and 90 MHz with a 5 V power supply Figure 1 6 THS7002 EVM Preamplifier Frequency Response f Frequency Hz 100k 1M 10M 100M 6 4 2 7...

Page 20: ...to 2 dB Typical 3 dB bandwidth is 65 MHz with a 5 V power supply and 70 MHz with a 15 V power supply Figure 1 8 THS7002 EVM PGA Frequency Response f Frequency Hz 100k 1M 10M 100M 3 1 4 2 0 2 1 500M VO...

Page 21: ...he PGA was set to a gain of 2 dB Typical 3 dB bandwidth is 65 MHz with a 5 V power supply and 70 MHz with a 15 V power supply Figure 1 10 THS7002 EVM Preamplifier PGA Frequency Response f Frequency Hz...

Page 22: ...minimize stray capacitance and reduce ground plane noise coupling into these pins This is especially important for the inverting pin while the amplifier is operating in the noninverting mode Because...

Page 23: ...al pad Figure 1 12 PowerPAD PCB Etch and Via Pattern Thermal pad area 0 15 x 0 17 with 10 vias Via diameter 13 mils 2 Place 18 holes in the area of the thermal pad These holes should be 13 mils in dia...

Page 24: ...application In the example above if the size of the internal ground plane is approximately 3 inches 3 inches then the expected thermal coefficient JA is about 27 8_C W For a given JA the maximum powe...

Page 25: ...roper thermal management when using PowerPAD mounted devices Correct PCB layout and manufacturing techniques are critical for achieving adequate transfer of heat away from the PowerPAD IC package More...

Page 26: ...t voltage VI VCC max Output drive THS7002 Preamplifiers IO 90 mA typ Output drive THS7002 PGA IO 45 mA typ Continuous total power dissipation at TA 25 C THS7002 4 5 W max For complete THS7002 amplifie...

Page 27: ...ence This chapter includes a parts list and PCB layout illustrations for the THS7002 EVM Topic Page 2 1 THS7002 Dual Differential Line Drivers and Receivers EVM Parts List 2 2 2 2 THS7002 EVM Board La...

Page 28: ...ish 2 DIGI KEY CT2196MST ND R6 R14 RESISTOR 0 1 8 W 1 SM 1206 2 R4 RESISTOR 22 1 8 W 1 SM 0805 1 R15 R18 R31 R41 RESISTOR 49 9 1 10 W 1 SM 0805 4 R5 R9 R16 R17 RESISTOR 49 9 1 8 W 1 SM 1206 4 R44 R45...

Page 29: ...Amp B Output Texas Instruments SLOP136 Rev B THS7002 EVM Board PGA B Output PGA A Output VCC GND 5 V VCC C5 C4 L2 L1 C21 GND J6 J1 J2 J3 J4 C17 GND AG2 3 AG1 2 AG0 1 R18 R5 C7 C8 R11 C6 R6 R7 R8 JP1 R...

Page 30: ...THS7002 EVM Board Layouts 2 4 Reference Figure 2 2 THS7002 EVM PC Board Top Assembly Figure 2 3 THS7002 EVM PC Board Top Layer...

Page 31: ...THS7002 EVM Board Layouts 2 5 Reference Figure 2 4 THS7002 EVM PC Board Bottom Layer Top VIew...

Page 32: ...2 6 Reference...

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