Texas Instruments 4Q 2006
Interface Selection Guide
Texas Instruments (TI) provides complete interface solutions that empower you to differentiate your products and accelerate time-to-market.
Our expertise in high-speed, mixed-signal circuits, system-on-a-chip integration and advanced product development processes ensures you will
receive the silicon, support tools, software and technical documentation to create and deliver the best products on time and at competitive prices.
Included in this selection guide you will find design considerations, technical overviews, graphic representation of portfolios, parametric tables
and resource information on the following families of devices:
LVDS:
(p. 4) TIA/EIA-644A specification
designed for differential transmission
delivering signaling rates into the Gbps range
and power in the mW range with low EMI to
the telecommunication and consumer markets.
xECL:
(p. 4) Emitter coupled logic (xECL),
high-speed differential interface technology
designed for low jitter and skew.
CML:
(p. 4) Current-mode logic (CML), high
speed differential interface technology.
M-LVDS:
(p. 8) TIA/EIA-899 specification with
all the benefits of LVDS applicable to multi-
point bus architecture in backplanes. Used
often for clock distribution, e.g. AdvancedTCA.
Digital Isolators:
(p. 10) The new ISO72x
high-speed digital isolators use state-of-the-art
integrated capacitive coupling and silicon-
dioxide isolation barrier to provide up to
150-Mbps signaling rate with only 1-ns jitter,
best-of-class noise immunity and high reliability.
RS-485/422:
(p. 11) Robust TIA/EIA-485 and
TIA/ EIA-422 specifications specially designed
for harsh, industrial environments transmitting
a differential signal up to 50 Mbps or 1.2 km.
RS-232:
(p. 13) TIA/EIA-232 specification
defining single-ended interface between data
terminal equipment (DTE) and data circuit-
terminating equipment (DCE).
UARTs:
(p. 16) Universal Asynchronous
Receiver/Transmitters are the key logic compo-
nent of serial communication utilizing RS232,
RS485/422 or LVDS transceivers to transmit or
receive between remote devices performing
parallel to serial conversion in the transmit
process and serial to parallel conversion in the
receive process.
CAN:
(p. 18) Controller Area Network
(ISO11898) specification commonly used in
automotive and industrial applications describes
differential signaling at a rate up to 1 Mbps on
a 40-meter bus with multipoint topology.
CardBus Power Switches:
(p. 34) The
CardBus controller uses the card detect and
voltage sense pins to determine a PC card’s
voltage requirements and then directs the
PCMCIA power switch to enable the proper
voltages. Standard PC cards require that V
CC
be switched between ground, 3.3 V, and 5 V,
while VPP is switched between ground, 3.3 V,
5 V, and 12 V. CardBay sockets have the stan-
dard requirements for VCC, but require ground,
3.3 V, and 5 V to VPP, and ground, 1.8 V, or 3.3
V to V
CORE
. Other PC card applications may
simply not need 12 V or VPP while still having
the standard requirements for V
CC
. Therefore,
consider the voltage requirements of the
application when selecting a PCMCIA
power switch.
1394:
(p. 36) IEEE 1394 (FireWire
®
) high-speed
interconnection enables simple, low-cost,
high-bandwidth, real-time data connectivity
between computers, peripherals and consumer
electronics.
GTLP:
(p. 39) Gunning transceiver logic plus
(GTLP) derived from the JEDEC JESD8-3 GTL
standard is a reduced-voltage-swing
technology designed for high-speed interface
between cards operating at LVTTL logic levels
and backplanes operating at GTLP signal levels.
VME:
(p. 41) The VMEbus™ is a standardized,
64-bit, backplane architecture that is coordi-
nated and controlled by VITA. VME is used
extensively in military, industrial and aerospace
applications.
Clock Distribution Circuits:
(p. 42)
TI offers both single-ended and differential
clock buffers that perform from below 200 MHz
up to 3.5 GHz in a variety of fan-out options. In
addition to simple option for customers needing
differential signals (LVPECL) and single-ended
signals (LVTTL/LVCMOS) from the same device.
FlatLink™ 3G:
(p. 19) A new family of serial-
izers and deserializers designed for mobile
phone displays.
SerDes:
(p. 20) Serializers and deserializers
in the gigabit range designed to bridge large
numbers of data bits over a small number of
data lines in telecommunication applications.
DVI/PanelBus™:
(p. 22) The Digital Visual
Interface Specification, DVI, is an industry
standard developed by the Digital Display
Working Group (DDWG) for high-speed digital
connection to digital displays. DVI uses
transition-minimized DC balanced (TMDS)
data signaling.
TMDS:
(p. 24) Transition minimized differential
signaling is the electrical interface used by DVI
and HDMI.
USB Hub Controllers and Peripheral
Devices:
(p. 25) The USB standard was
established to make connecting PCs, peripher-
als and consumer electronics flexible and easy.
The hub controller manages USB port connect/
disconnect activities and a peripheral controller
enables USB connectivity of a peripheral
device to either a host or hub.
USB Port Protection:
(p. 26) Transient voltage
suppressor protects USB 1.1 devices from ESD
and electrical noise transients.
USB Power Managers:
(p. 27) TI products,
like TPS204xA and TPS205xA, are designed to
meet all the USB 1.0 and 2.0 requirements for
current-limiting and power switching to reliably
control the power on the voltage bus.
PCI Express
®
:
(p. 29) A robust, scalable,
flexible and cost-effective I/O interconnect.
PCI Bridges:
(p. 33) A peripheral component
interconnect (PCI) bridge provides a high-
performance connection path between either
two PCI buses or a PCI component and one or
more DSP devices.
Interface Selection Guide
Introduction
3
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