RAM (64K bytes)
subsystem
Camera
subsystem
IVA2
Device
L3 interconnect
SDRAM controller
subsystem
GPMC
ROM (32K bytes)
OCM_ROM
OCM_RAM
OCM subsystem
DAP
Display
SDRAM external
memory
Flash ROM, NAND
external memories
USB
2D/3D
System
DMA
-Boot code
subsystem
graphics
USB HS
D2D
Ocm-003
MPU
Public Version
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On-Chip Memory Subsystem
10.3 On-Chip Memory Subsystem
10.3.1 OCM Subsystem Overview
The on-chip memory subsystem consists of two separate on-chip memory controllers, one connected to
an on-chip ROM (OCM_ROM) and the other connected to an on-chip RAM (OCM_RAM). Each memory
controller has its own dedicated interface to the L3 interconnect.
is an overview of the OCM subsystem.
Figure 10-78. OCM Subsystem Overview
Multiple L3 initiators (such as remote devices) have access to the RAM through 2D/3D graphics, the MPU
subsystem, sDMA, the camera subsystem, the display subsystem, IVA2, and USB.
ROM is used for direct boot code and boot from external NAND flash.
2331
SWPU177N – December 2009 – Revised November 2010
Memory Subsystem
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