5 PCB Layout
Top Layer and Silkscreen Layer
show the board layout for the LM5013-Q1EVM.
The EVM offers resistors, capacitors, and test points to configure the output voltage, precision enable, and
switching frequency.
The 8-pin SO PowerPAD package offers an exposed thermal pad, which must be soldered to the copper landing
on the PCB for optimal thermal performance. The PCB consists of a 4-layer design. There are 2-oz copper
planes on the top and bottom and 1-oz copper mid-layer planes to dissipate heat with an array of thermal vias
under the thermal pad to connect to all four layers.
Test points have been provided for ease of use to connect the power supply, required load, and to monitor critical
signals.
Figure 5-1. Top Layer and Silkscreen Layer
Figure 5-2. Mid-Layer 1 Ground Plane
Figure 5-3. Mid-Layer 2 Routing
Figure 5-4. Bottom Layer Routing
PCB Layout
SNVU754A – OCTOBER 2021 – REVISED NOVEMBER 2021
LM5013-Q1EVM User's Guide
9
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