Texas Instruments LM5013-Q1EVM, User Manual, Page: 1 / 18

User’s Guide
LM5013-Q1EVM User's Guide
ABSTRACT
The LM5013-Q1EVM has a 100-V DC/DC buck regulator that employs asynchronous rectification and achieves
high conversion efficiency. The EVM operates over a wide input voltage range of 15-V to 100-V to provide a
regulated 12-V output at 300-kHz switching frequency. The module design uses the LM5013-Q1 asynchronous
buck converter with wide input voltage (wide V
IN
) range, wide duty-cycle range, integrated high-side power
MOSFET, cycle-by-cycle overcurrent protection, and precision enable. With AEC-Q100 grade 1 automotive
qualification, the LM5013-Q1 is rated to operate over a junction temperature range of –40°C to +150°C. The
LM5013-Q1 is available in an 8-pin SO PowerPAD
™
package to enable high density, low component count
DC/DC solutions.
Use the LM5013-Q1 with WEBENCH® Power Designer LM5013-Q1 with WEBENCH® Power Designer to
create a custom regulator design.
Table of Contents
1 General TI High Voltage Evaluation User Safety Guidelines .............................................................................................. 2
2 Overview .................................................................................................................................................................................. 4
2.1 LM5013-Q1 Asynchronous Buck Converter....................................................................................................................... 4
3 LM5013-Q1 Evaluation Module .............................................................................................................................................. 5
3.1 Quick Start Procedure........................................................................................................................................................ 5
3.2 Detailed Descriptions......................................................................................................................................................... 6
4 Schematic ................................................................................................................................................................................ 8
5 PCB Layout .............................................................................................................................................................................. 9
6 Bill of Materials ..................................................................................................................................................................... 10
7 Performance Curves ............................................................................................................................................................. 11
8 Revision History ................................................................................................................................................................... 12
List of Figures
Figure 2-1. LM5013-Q1 Pin Configuration (8-Pin SO Package with PowerPAD, Top View)........................................................ 4
Figure 2-2. LM5013-Q1 Buck Regulator Simplified Schematic................................................................................................... 4
Figure 3-1. LM5013-Q1 EVM Top View....................................................................................................................................... 5
Figure 4-1. LM5013-Q1 EVM Schematic..................................................................................................................................... 8
Figure 5-1. Top Layer and Silkscreen Layer................................................................................................................................ 9
Figure 5-2. Mid-Layer 1 Ground Plane........................................................................................................................................ 9
Figure 5-3. Mid-Layer 2 Routing.................................................................................................................................................. 9
Figure 5-4. Bottom Layer Routing................................................................................................................................................ 9
Figure 7-1. Thermal Capture of EVM: V
IN
= 48-V, V
OUT
= 12-V, I
OUT
= 1.5-A............................................................................. 11
List of Tables
Trademarks
PowerPAD ™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
www.ti.com Table of Contents
SNVU754A – OCTOBER 2021 – REVISED NOVEMBER 2021
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