Texas Instruments HDC1050EVM, User Manual, Page: 38 / 46

Board Layout
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4 Board Layout
Figure 52 and Figure 53 show the board layout for the HDC1050EVM. Note that the DAP pad on the
HDC1050 is grounded on the EVM, but in most system designs, should be left floating (not contacted with
GND) to reduce the influence of the PCB thermals on the temperature measurement.
Figure 52. Top Layer Routing
Figure 53. Bottom Layer Routing
38 HDC1050EVM User 's Guide SNAU181A – June 2015 – Revised June 2015
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